A flip-chip bonding device

Abstract

The present disclosure provides a flip chip bonding device, comprising a chip transmission mechanism, the chip transmission mechanism comprising an installation part and a driving part configured to drive the installation part to move, the installation part comprising a plurality of workstations for bearing chips, wherein the chip located on one of the workstations is moved from a first position to a second position through movement of the installation part; a first chip grabbing mechanism, configured to overturn the chips upwards from the lower side after grabbing the chips and putting the chips on the workstations located in the first position on the installation part after overturning the chips; a second chip grabbing mechanism, configured to take out the chips on the workstations located in the second position on the installation part so as to bond. The present disclosure introduces the precise chip transmission mechanism, the reliability is high, and the flip chip bonding device is enabled to be applicable to flip chip bonding of large-scale base materials while not reducing the efficiency, thereby greatly increasing the chip installation accuracy.

Description

technical field [0001] The invention relates to the technical field of flip-chip bonding, in particular to flip-chip bonding equipment. Background technique [0002] With the rapid development of global electronic information technology, consumers need smaller portable electronic products, so that advanced packaging and interconnection technologies are surpassing traditional technologies. Advanced packaging technology integrates semiconductor packaging and assembly technology to reduce product prices, improve performance, increase density and reduce product size, which makes the market demand for flip-chip semiconductor packaging is growing rapidly. Flip chip is not only a high-density chip interconnection technology, but also an ideal chip bonding technology, which has been widely used in PGA, BGA and CSP. The interconnection line of the flip chip is very short, and the I / O leads are distributed on the entire chip surface. At the same time, the flip chip industry is suitab...

AI Technical Summary

Problems solved by technology

The structure of the device is complex and difficult to implement

Chinese patent CN200610171125.6 applied by Patrick Blesing et al. of Switzerland ESEC Company discloses a flip-chip bonding device that uses a bonding head swing mechanism to realize chip transfer, which can compensate for the movement of individual components caused by heat. impact, but its use of a swing mechanism reduces the loading accuracy

The patent CN201310173823.X applied by Zheng Xianquan and others of Hanmi Semiconductor Co., Ltd. discloses a flip chip welding equipment. Substrate alignment cameras mounted on moving bond heads, resulting in reduced efficiency and accuracy

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