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Warpage Control in Package-on-Package Construction

A technology for packaging parts and packaging substrates, which is used in semiconductor/solid-state device manufacturing, electrical components, semiconductor devices, etc.

Active Publication Date: 2020-01-10
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, in the resulting package, there is significant warpage

Method used

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  • Warpage Control in Package-on-Package Construction
  • Warpage Control in Package-on-Package Construction
  • Warpage Control in Package-on-Package Construction

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0027] The making and using of embodiments of the invention are discussed in detail below. It should be appreciated, however, that the embodiments provide many applicable concepts that can be embodied in a wide variety of specific contexts. The specific embodiments discussed are illustrative, and do not limit the scope of the invention.

[0028] According to various embodiments, packages and methods of forming the same are provided. According to some embodiments, intermediate stages of forming the package are shown. Variations of the examples are discussed. The same reference numerals are used to designate the same elements throughout the various views and illustrative embodiments.

[0029] Figure 1 to Figure 9 is a cross-sectional view of a package-on-package (PoP) structure at an intermediate stage in fabrication, according to some example embodiments. refer to figure 1 , a packaging assembly 10 is provided. In some embodiments, package assembly 10 is a package subst...

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Abstract

A package includes a bottom substrate and a bottom die over and bonded to the bottom substrate. A metal-particle-containing compound material is overlying a top surface of the bottom die, wherein the metal-particle-containing compound material comprises metal particles. A molding material molds at least a lower part of the bottom die therein, wherein the molding material is overlying the bottom substrate.

Description

technical field [0001] The present invention relates to integrated circuit devices, and more particularly, to warpage control in package-on-package structures. Background technique [0002] In a conventional package-on-package (PoP) process, the top package (in which the first device die is bonded) is further bonded to the bottom package by solder balls. The bottom package may also include a second device die bonded therein. The second device die may be on the same side of the bottom package as the solder balls. [0003] A molding compound is applied to the bottom package prior to bonding the top package to the bottom package, wherein the molding compound covers the second device die and the solder balls. Since the solder balls are embedded in the molding compound, laser ablation or drilling is performed to form holes in the molding compound, thereby exposing the solder balls. The top and bottom packages can then be bonded by solder balls in the bottom package. [0004] ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/29H01L25/065H01L23/31H01L21/98
CPCH01L23/3128H01L23/49816H01L23/49827H01L23/562H01L24/92H01L25/105H01L25/50H01L2224/0401H01L2224/04042H01L2224/16225H01L2224/32225H01L2224/48227H01L2224/73265H01L2225/1023H01L2225/1058H01L2225/1094H01L2924/00014H01L2924/12042H01L2924/15311H01L2924/15331H01L2924/181H01L2924/1815H01L2924/3511H01L2924/00H01L2924/00012H01L2224/45015H01L2924/207H01L2224/45099H01L23/28H01L25/0657H01L25/074H01L21/4853H01L21/4867H01L21/565H01L23/3114H01L23/3736H01L23/49838H01L24/16H01L24/32H01L24/83H01L2224/16227H01L2224/29147H01L2224/32245H01L2224/33517H01L2224/33519H01L2224/83851H01L2224/83855
Inventor 陈威宇胡毓祥林威宏郑明达刘重希
Owner TAIWAN SEMICON MFG CO LTD