Laser drilling method for amorphous silicon solar cell glass substrate
A laser drilling and glass substrate technology, applied in laser welding equipment, welding equipment, metal processing equipment, etc., can solve the problems of easily polluted membrane surface and high equipment cost
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- Publication Date
- 2015-06-24
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Figure 1 Figure 2
Abstract
Description
technical field
[0001] The invention belongs to the field of drilling holes for amorphous silicon solar cells, in particular to a laser drilling method for glass substrates of amorphous silicon solar cells. Background technique
[0002] With the increasingly serious problems of global energy shortage and environmental pollution, solar photovoltaic power generation has become an emerging industry that is widely concerned and focused on development because of its clean, safe, convenient, and high-efficiency characteristics. However, my country is rich in solar energy resources, and the land area suitable for solar power generation and the light-receiving area of buildings are large. At present, the total area of buildings with green building evaluation marks in China is less than 40 million square meters, and there is huge space for the development of green buildings in the future.
[0003] Building Integrated Photovoltaics (BIPV) is suitable for most buildings, such as fl...
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Embodiment Construction
[0019] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0020] Such as figure 1 , 2 As shown, the embodiment of the present invention provides a laser drilling method for the glass substrate of an amorphous silicon solar cell. The film surface of the glass substrate 12 coated with the film layer 11 is placed upwards, and then from the edge of the through hole 13 to be drilled to the The film layer in a circular ring 14 is removed, and then in the circular ring where the film layer is removed, the laser drills holes in layers upward from the lower surface of the glass substrate.
[0021] In this embodiment, the plated film layer has three layers a, b, ...