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Device, method and system for gas switching in semiconductor processing equipment

A gas switching and processing equipment technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of increasing gas switching speed, achieve the effect of improving production efficiency and shortening the time of gas switching

Active Publication Date: 2015-06-24
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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Problems solved by technology

[0004] In order to solve the problem that the gas switching speed in semiconductor processing equipment needs to be further improved, the present invention proposes a device, method and system for gas switching in semiconductor processing equipment

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  • Device, method and system for gas switching in semiconductor processing equipment
  • Device, method and system for gas switching in semiconductor processing equipment
  • Device, method and system for gas switching in semiconductor processing equipment

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Embodiment Construction

[0052] In order to make the object, technical solution and advantages of the present invention clearer, the specific implementation of the device, method and system for gas switching in semiconductor processing equipment according to the embodiment of the present invention will be described below with reference to the accompanying drawings. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0053] Such as figure 1 As shown, the gas switching device 100 in the semiconductor processing equipment according to the embodiment of the present invention includes a flow controller, a front-end control valve, a rear-end control valve, and an exhaust control valve.

[0054] The flow controller is connected between the front-end control valve and the back-end control valve, and is connected to the front-end control valve and the back-end control valve, to control the gas flow value ente...

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Abstract

The invention discloses a device, method and system for gas switching in semiconductor processing equipment. The method comprises the steps that semiconductor processing process steps in a process form and the gas flow value of each gas channel in each process step are read; the gas flow values of gas channels in the first process step are synchronously set, and the gas flow values of gas channels in the next process step are asynchronously set; after the first process step is executed, the next process step continues to be executed; the gas flow values of gas channels in the current process step are synchronously set, and the gas flow values of gas channels in the next process step are asynchronously set; after the current process step is executed, the next process step in the process form continues to be executed till all process tasks in the process form are completed. Only two control valves need to be operated in gas switching in the semiconductor processing process, the gas switching time between the process steps is greatly shortened, and the semiconductor processing production efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a device, method and system for gas switching in semiconductor processing equipment. Background technique [0002] In the manufacturing process of 3D IC (Integrated Circuit, integrated circuit, semiconductor component products), TSV (Through Silicon Via, through silicon channel) etching is an essential step. This high aspect ratio etching Requirements, ordinary technology can not be achieved, a commonly used method is to use BOSCH technology to achieve. Since the duration of the deposition step and the etching step of the BOSCH process is very short, and in some cases a single step is even only 1 second, this requires a very fast switching speed between the process steps, and the process conditions in each step need to be Realize switching and stabilization in a shorter time, such as gas flow value. The type and flow rate of the process gas is one of the main parameters ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
Inventor 马平
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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