Copper plating solution capable of realizing co-plating of through hole, blind hole and circuit

Abstract

The invention provides a copper plating solution capable of realizing co-plating of a through hole, a blind hole and a circuit, which belongs to the field of manufacturing of circuit boards. The copper plating solution is characterized by comprising the following components: copper methanesulfonate, methanesulfonic acid, hydrochloric acid, an accelerator, an inhibitor and a leveling agent. The copper plating solution has the following advantages: the copper plating solution can realize full copper filling of the blind hole and filling of the through hole and meet requirements of pattern plating in practical production; on the premise that smoothness of the circuit is good, the blind hole can be effectively filled up and mad even, the through hole is basically filled up and mad even, hole wrapping conditions are substantially improved, and the qualified ratio of products is substantially increased; and the copper plating solution effectively overcomes the problem that different copper plating solutions are needed for production of package substrates and further improves the wiring density of substrate products.

Description

technical field [0001] The invention relates to a copper plating solution for co-plating through holes, blind holes and lines. Background technique [0002] Electroplating is a key process in printed circuit boards and semiconductor packaging substrates. At present, electroplating is mainly used for electrical interconnection between layers of printed circuit boards. With the development of application technology, the increase of wiring density and the increase of high-power devices , the heat dissipation requirements of the packaging substrate are becoming more and more significant. For high-density packaging substrates, the structure contains a large number of through holes and blind holes. Blind holes or through holes are generally located in the center of the pad. In order to effectively increase the density of wiring, the aperture of blind holes or through holes must be small enough. Usually 30~100μm. Of course, there may also be some heat conduction holes. The heat c...

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Problems solved by technology

Therefore, it leads to the development of a full copper filling that can satisfy blind holes and fill through holes (usually 100% full copper filling is not required, but the copper thickness of the hole usually needs to reach 15um or more), and it must also be able to meet the pattern electroplating production line requirements, there is no such medicine on the market

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