Ceramic substrate on which LED is directly packaged

Abstract

The invention discloses a ceramic substrate on which an LED is directly packaged. The ceramic substrate comprises a ceramic substrate body, a medium-power horizontal chip, electrodes and cooling fins. A traditional high-power flip chip is replaced by designing the medium-power horizontal chip, due to the fact that the medium-power horizontal chip is small in energy consumption and low in cost, the production cost and the usage cost can be effectively reduced; in addition, due to the fact that the ceramic substrate is an aluminum oxide ceramic plate with reflectivity greater than 92%, light reflection is achieved depending on an intrinsic bright surface of ceramic, compared with a traditional light reflection mode of adopting a silver layer on the surface, silver is prone to being oxidized and blackening under high pressure, the reflectivity is poor, and the price of silver materials is high, so that the production cost stays at a high level, and the disadvantages can be overcome by adopting the aluminum oxide ceramic plate.

Description

technical field [0001] The invention relates to the technology in the field of LEDs, in particular to a ceramic substrate on which LEDs are directly packaged on the board. Background technique [0002] Traditional ceramic substrate products generally include a ceramic substrate, a conductive electrode and a high-power flip chip arranged on the front of the ceramic substrate, and a heat sink arranged on the back of the ceramic substrate. Both the conductive electrode and the heat sink are made of metal, usually made of copper. to facilitate conduction. Because the color of copper is relatively dark and the reflectivity is not strong, the reflectivity is not high enough after being made into finished LED products. [0003] In view of this, those skilled in the art cover a layer of silver on the surface of the ceramic substrate by means of chemical deposition, and use the high reflectivity of silver to make the finished product have a strong reflective function. However, meta...

AI Technical Summary

Problems solved by technology

However, metallic silver is easy to oxidize and turn black under high pressure, and the reflectivity is poor, and the price of silver material is high, resulting in high production costs

[0004] Furthermore, for high-power flip-chips (above 3W), high-power flip-chips consume a lot of energy, and high-power flip-chips themselves are relatively expensive, and the cost of use is too high

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