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Laser cutting machine

A technology of laser cutting machine and frame, which is applied in the direction of laser welding equipment, welding equipment, metal processing equipment, etc. It can solve the problems that laser cutting cannot be realized, and achieve the effect of small size, accurate position and high precision

Inactive Publication Date: 2015-07-15
SHENZHEN KINGRAY LASER EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the embodiment of the present invention is to provide a laser cutting machine, aiming to solve the problem that the existing technical solutions cannot achieve laser cutting

Method used

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  • Laser cutting machine
  • Laser cutting machine
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Embodiment Construction

[0016] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0017] The specific embodiment of the present invention provides a kind of laser cutting machine, and this laser cutting machine is as figure 1 As shown, it includes: a frame assembly 1, a cutting assembly 2 and a waste collection device 3; wherein, the waste collection device 3 is arranged at the bottom of the cutting assembly 2, and the frame assembly 1 is also provided with a waste collection vehicle below the waste collection device 3 10;

[0018] Such as figure 2 As shown, the cutting assembly 2 includes: a cutting substrate 20, a cutting manipulator assembly 21, and a cutting clamping dev...

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Abstract

The invention belongs to the field of machinery and laser equipment and provides a laser cutting machine which comprises a machine frame assembly, a cutting assembly and a waste material collecting device. The waste material collecting device is arranged at the bottom of the cutting assembly; a waste material collecting trolley is further arranged on the machine frame assembly and under the waste material collecting device; the cutting assembly comprises a cutting base plate, a cutting manipulator assembly and a cutting clamping device; the cutting manipulator assembly and the cutting clamping device are both fixedly connected on the cutting base plate; a middle hole is formed in the cutting base plate; the middle hole is communicated with an inlet of the waste material collecting device; the cutting manipulator assembly comprises a laser cutting head, an X shaft, a Y shaft, a Y shaft connecting plate, a Z shaft, a ball screw and a driving device. According to the technical scheme, the laser cutting machine has the advantages of being high in accuracy and small in size.

Description

technical field [0001] The invention belongs to the field of machinery and laser equipment, and in particular relates to a laser cutting machine. Background technique [0002] laser cutting is will be from laser The emitted laser is focused into a high power density the laser beam, laser Beam irradiated to workpiece surface, bringing the workpiece to its melting or boiling point, while the high-pressure gas coaxial with the beam will melt Or vaporized metal is blown away, and with the movement of the relative position of the beam and the workpiece, the material will eventually form a slit, so as to achieve the purpose of cutting. laser Cutting processing uses invisible beams instead of traditional mechanical knives. It has the characteristics of high precision, fast cutting, not limited to cutting patterns, automatic typesetting saves materials, smooth cuts, and low processing costs. Contents of the invention [0003] The purpose of the embodiments of the p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/38B23K26/08B23K26/70
CPCB23K26/38B23K26/0884
Inventor 杨学才
Owner SHENZHEN KINGRAY LASER EQUIP