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Method of cutting protection glue at wafer notch during wafer back face thinning and grinding process

A backside thinning and grinding process technology, used in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of easy failure in tearing glue, and it is difficult for glue tearing machines to detect the position of the chip gap, so as to improve the success rate. Effect

Active Publication Date: 2015-07-15
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] For the first method, if you use a protective film with higher viscosity and thicker, the peeling process is prone to failure
For the second method, it is difficult for the glue tearer to detect the position of the wafer gap and send an alarm

Method used

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  • Method of cutting protection glue at wafer notch during wafer back face thinning and grinding process
  • Method of cutting protection glue at wafer notch during wafer back face thinning and grinding process
  • Method of cutting protection glue at wafer notch during wafer back face thinning and grinding process

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Embodiment Construction

[0028] based on the following Figure 5 and Figure 6 , specifically explain the preferred embodiment of the present invention.

[0029] The wafer backside thinning and grinding process includes the following steps:

[0030] Step 1. Apply a layer of protective glue on the surface of the wafer using a glue applicator;

[0031] Step 2, cutting the protective glue at the chip gap;

[0032] Step 3, performing back grinding and spin etching processes on the wafer;

[0033] Step 4. Use a glue tearing machine to remove the protective glue on the surface of the wafer.

[0034] Such as Figure 5 As shown, the present invention provides a method for cutting the protective glue at the wafer notch for the thinning and grinding process on the back of the wafer. The protective glue 102 at the wafer notch 105 is completely cut off, but part of the protective glue at the notch is reserved.

[0035] Such as Figure 6 As shown, the angle between the side of the protective glue remaining...

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Abstract

The invention discloses a method of cutting protection glue at a wafer notch during a wafer back face thinning and grinding process. The protection glue cutting method is carried out after a glue mount process and before a back face grinding and rotary etching process. According to the protection glue cutting method, the protection glue at the wafer notch is not fully removed, and the protection glue at part of the notch is kept. A thick protection film with high viscosity can be used for protecting the surface of the wafer, and the flue removing success rate is improved on the basis of reducing the waste wafer rate.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a method for cutting protective glue at wafer notches used in wafer back thinning and grinding processes. Background technique [0002] When performing the wafer backside grinding process, it is first necessary to use a glue applicator to paste a layer of protective glue 102 on the surface of the wafer 101 (such as figure 1 shown), the protective glue 102 can protect the surface of the wafer 101 from damage during the subsequent back grinding and rotary etching processes, and after the back thinning and grinding process is completed, the protective glue on the wafer surface can be removed by a glue tearing machine 102. [0003] Such as figure 2 As shown, when tearing the glue, the glue tearing machine uses the support shaft 103 to ensure that the glue tearing tape 104 is tightly adhered to the back of the protective glue 102, and the protective glue 102 is torn off t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683H01L21/304
CPCH01L21/304H01L21/6836
Inventor 张泽松李儒兴李协吉
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP