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A jig for multi-chip printing of small low-temperature co-fired ceramic substrates

A technology of low-temperature co-fired ceramics and substrates, applied in printing, printing machines, rotary printing machines, etc., can solve the problems of low production efficiency, time-consuming equipment, etc., and achieve good application space, universal adaptability, and large market applications value effect

Inactive Publication Date: 2017-07-25
THE 45TH RES INST OF CETC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides a fixture for multi-chip printing of small-scale low-temperature co-fired ceramic substrates. The technical problem to be solved is that many small-scale LTCC manufacturers can only print one LTCC substrate at a time, and the production efficiency is low and time-consuming. account for equipment

Method used

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  • A jig for multi-chip printing of small low-temperature co-fired ceramic substrates
  • A jig for multi-chip printing of small low-temperature co-fired ceramic substrates
  • A jig for multi-chip printing of small low-temperature co-fired ceramic substrates

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Embodiment Construction

[0038] The principles and features of the present invention will be described below with reference to the accompanying drawings. The examples are only used to explain the present invention, but not to limit the scope of the present invention.

[0039] like Figure 5 and Image 6 Shown is a schematic diagram of a low temperature co-fired ceramic substrate 9 (referred to as LTCC substrate). The size of the substrate is 3.55 mm x 4.35 mm x 21 mm.

[0040] The embodiment of the present invention aims to solve the technical problems that many small-scale LTCC manufacturers can only print one LTCC substrate at a time, the production efficiency is low, and time-consuming equipment is required.

[0041] like image 3 and Figure 4 As shown, it is a schematic diagram of a jig for multi-piece printing of small-sized low-temperature co-fired ceramic substrates provided by the embodiment of the present invention. A jig for multi-chip printing of small low-temperature co-fired ceramic ...

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Abstract

The invention relates to a jig for multi-piece printing of small-scale low-temperature co-fired ceramic substrates, belonging to the technical field of low-temperature co-fired ceramic printing. The fixture includes: a bottom plate, the bottom plate is provided with at least two positioning grooves; at least one fixed plate, the fixed plate is fixed on the upper surface of the bottom plate; the first side plate and the second side plate are fixed on the end of the bottom plate, parallel to the fixed plate ; the first shaft and the second shaft are installed between the first side plate and the second side plate; the spring is installed on the first shaft and the second shaft respectively; hole; the through hole of the partition is installed through the first shaft and the second shaft; the compression sleeve, the compression sleeve is respectively sleeved on the first shaft and the second shaft, and is located on the two adjacent partitions Between; wedge, one end of the wedge is hinged on the first shaft or the second shaft. The invention is a jig used for multi-chip printing of small low-temperature co-fired ceramic substrates, realizes batch printing of small LTCC substrates, and provides technical support for batch production of small LTCCs.

Description

technical field [0001] The invention belongs to the technical field of low-temperature co-fired ceramic printing, and in particular relates to a jig used for multi-piece printing of small-scale low-temperature co-fired ceramic substrates. Background technique [0002] The main purpose of Low Temperature Co-fired Ceramic (LTCC) technology is to integrate passive components in a two-dimensional space, that is, circuit components such as resistors, capacitors, and inductors, into a circuit structure in a three-dimensional space. Use conductive glue doped with gold, silver, copper and other metals as electrodes, and use screen printing technology to design circuits on layers of ceramic green layers, and then laminate all the green layers at a temperature below about 1000°C And once sintered, the metal and ceramics are closely combined to form a low-temperature co-fired ceramic substrate. In this way, the original large-area circuit can be three-dimensionalized, the assembly den...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B41F17/00
Inventor 任晓庆
Owner THE 45TH RES INST OF CETC
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