Height measuring device and method for laser cutting

Abstract

The invention provides a height measuring device and a height measuring method for laser cutting. The height measuring device comprises a bottom plate, a movable table mechanism, a height detecting mechanism and a control system. The movable table mechanism is arranged on the upper side of the bottom plate, the movable table mechanism and the height detecting mechanism are connected to the control system, the movable table mechanism comprises two supporting seats, a worktable, a zero-position sensor and a driving assembly, the two supporting seats are oppositely arranged on the bottom plate, the worktable is used for accommodating workpieces and is fixed to a position between the two supporting seats, the zero-position sensor is arranged on the supporting seats, the height detecting mechanism is fixed to the bottom plate, and the driving assembly can drive the worktable to perpendicularly move up and down relative to the height detecting mechanism. The height measuring device and the height measuring method have the advantages that the problem of manual repeated technological experiments for existing laser cutting machines due to different heights of cut objects can be effectively solved by the aid of the height measuring device and the height measuring method, detection signals are stable, the height measuring device is simple in structure, and damage to the surfaces of measured objects can be prevented.

Description

technical field [0001] The invention relates to the technical field of laser processing, in particular to a height measuring device and method for laser cutting. Background technique [0002] Laser cutting is the use of a high-energy-density laser beam to act on the target, so that the target surface generates enough heat to melt the material, and the high-pressure gas coaxial with the beam directly removes the molten material, so as to achieve the purpose of cutting. In the production of the semiconductor industry, there are certain requirements for the depth of the mark. Some semiconductor devices are not allowed to penetrate the protective layer during the cutting process, and some require the depth of the mark to be within a few microns. The realization of these requirements first needs to be measured. The height of the cutting object. At present, the commonly used measurement methods include mechanical measurement, infrared detection, laser detection, etc. These method...

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Problems solved by technology

[0003] The purpose of the present invention is to propose a height measuring device and method for laser cutting, which can solve the problem of artificially repeated process experiments of existing laser cutting machines due to different heights of cutting objects, and the existing detection methods have unstable signals and low cost. High, complex control methods and other issues

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