Stripping method for ultrathin substrate, display substrate and display device

A display substrate and display device technology, applied in chemical instruments and methods, optics, lamination auxiliary operations, etc., can solve the problems of low yield rate and high difficulty, and achieve the effects of improving yield rate, easy implementation, and avoiding damage

Active Publication Date: 2015-07-22
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing stripping process is mainly realized by using separation liquid corrosion or mechanical stripping, which is difficult and has low yield

Method used

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  • Stripping method for ultrathin substrate, display substrate and display device
  • Stripping method for ultrathin substrate, display substrate and display device
  • Stripping method for ultrathin substrate, display substrate and display device

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Embodiment Construction

[0035] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0036] An embodiment of the present invention provides a method for peeling off an ultra-thin substrate, such as figure 1 As shown, the stripping method includes:

[0037] Step S1, providing an ultra-thin substrate and a rigid substrate, and attaching the ultra-thin substrate to the rigid substrate;

[0038] Step S2, forming a closed conductor c...

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Abstract

The invention discloses a stripping method for an ultrathin substrate, a display substrate and a display device. The stripping method includes the steps of providing the ultrathin substrate and a rigid substrate, and attaching the ultrathin substrate to the rigid substrate; forming a closed conductor coil on the ultrathin substrate; manufacturing a display part on the ultrathin substrate where the closed conductor coil is formed; forming a variation magnetic field, and stripping the ultrathin substrate and the display part from the rigid substrate under the effect of the variation magnetic field. By means of the stripping method, the difficulty generated when the substrate, in particular to the ultrathin substrate is stripped from the rigid substrate can be reduced.

Description

technical field [0001] The invention relates to the technical field of liquid crystal display manufacturing, in particular to a method for peeling off an ultra-thin substrate, a display substrate and a display device. Background technique [0002] One development direction of LCD (Liquid Crystal Display, liquid crystal display) is thinning. At present, the thinning of LCD is mainly achieved by chemical etching. However, the products thinned by the chemical etching method are fragile and have a low yield, which limits the scope of application of the chemical etching method. [0003] Another thinning method is also provided in the prior art. In this method, the strengthened ultra-thin glass is directly used to make LCD. Since the ultra-thin glass is strengthened, the strength and toughness are greatly increased, which can significantly improve the quality of thinned products. . [0004] And because the ultra-thin glass is too thin and too soft, it must be attached to the ca...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/1333
CPCB32B38/10G02F1/1333
Inventor 周晓东贾倩
Owner BOE TECH GRP CO LTD
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