Chip thermal pressure detection method and system and chip hot-pressing packaging control system

A detection method and technology of thermal pressure, which can be used in measurement devices, force/torque/work measuring instruments, semiconductor/solid-state device manufacturing, etc.

Active Publication Date: 2015-07-22
WUHAN HUAWEIKE INTELLIGENT TECH
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the defect that the existing hot-pressing system used for RFID label packaging equipment cannot realize the stable hot-pressing pressure, the present invention proposes a chip hot-pressure detection method, system and hot-pressing packaging control system. Characterize the pressure, adjust the air pressure according to the deviation of the indentation width, so as to ensure consistent pressure and improve the accuracy of hot pressing and the performance of finished products

Method used

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  • Chip thermal pressure detection method and system and chip hot-pressing packaging control system
  • Chip thermal pressure detection method and system and chip hot-pressing packaging control system
  • Chip thermal pressure detection method and system and chip hot-pressing packaging control system

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Embodiment Construction

[0057] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings. The description herein is only used to explain the present invention when referring to specific examples, and does not limit the present invention.

[0058] Such as figure 1 As shown, the overall process of the chip hot-press packaging control method of the present invention is as follows: first, the image of the indentation is collected, and then the characteristics of the indentation are extracted, and then the deviation between the indentation characteristics and the target value is calculated according to the indentation evaluation method, and the indentation evaluation It is to evaluate whether the hot pressing pressure is appropriate through the deviation of the indentation width: the indentation in the image is in the form of a ring, and the width of the ring...

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Abstract

The invention discloses a chip thermal pressure detection method. The method includes the steps of 1, a circular impression image made by a circular bump of a hot-pressed chip on an antenna; 2, extracting an outline and a center of circle from the circular impression image; 3, equally dividing the outline along the periphery into multiple arc segments; 4, acquiring width of each arc segment; 5, weighting and adding the widths of the arc segments to obtain impression width. The invention further provides a thermal pressure detection system and a chip hot-pressing packaging control system both based on the method; according a difference between the detected impression width and target impression width, a corresponding pressure control command is generated to adjust hot pressure of a hot-pressing head unit upon the chip. The pressure is indicated by the impression width, the magnitude of the pressure is adjusted according to the difference of the impression widths, and thus pressure uniformity is ensured and hot-pressing precision and product performance are improved.

Description

technical field [0001] The invention belongs to the technical field of electronic packaging, and relates to a chip thermal pressure detection method and system, and a thermal compression packaging control system. Background technique [0002] The hot pressing process is an important part of the RFID tag packaging process. The function of the hot pressing system is to achieve a reliable connection between the chip and the substrate through temperature and pressure. The hot pressing effect directly affects the performance parameters of the finished product. Appropriate temperature and pressure can ensure the quality of packaging and improve the performance of finished products. [0003] At present, most of the hot pressing systems suitable for packaging equipment with RFID tags have realized closed-loop control of hot pressing temperature, but the control of hot pressing pressure generally adopts an open-loop or semi-closed-loop method. The Chinese patent with the publication...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/66H01L21/67G01L5/00
CPCG01L5/0038H01L21/67092H01L22/12H01L22/20
Inventor 陈建魁熊志武尹周平
Owner WUHAN HUAWEIKE INTELLIGENT TECH
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