Chip thermal pressure detection method and system and chip hot-pressing packaging control system
A detection method and technology of thermal pressure, which can be used in measurement devices, force/torque/work measuring instruments, semiconductor/solid-state device manufacturing, etc.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0057] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings. The description herein is only used to explain the present invention when referring to specific examples, and does not limit the present invention.
[0058] Such as figure 1 As shown, the overall process of the chip hot-press packaging control method of the present invention is as follows: first, the image of the indentation is collected, and then the characteristics of the indentation are extracted, and then the deviation between the indentation characteristics and the target value is calculated according to the indentation evaluation method, and the indentation evaluation It is to evaluate whether the hot pressing pressure is appropriate through the deviation of the indentation width: the indentation in the image is in the form of a ring, and the width of the ring...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com