Wafer Supports and Degassing Process Chambers

Abstract

The invention provides a wafer supporting device and a degassing process chamber. The wafer supporting device comprises a fixing part, a connecting part and a supporting part. One end of the connecting part is connected with the fixing part, and the other end of the connecting part is connected with the supporting part. The supporting part is provided with a boss used for supporting a wafer. The supporting part is further provided with a limiting bench which is arranged at the other end away from the boss. A surface, facing the boss, of the limiting bench is provided with a slope. The area of contact between the wafer supporting device of the invention and a wafer is large, and the limiting bench is arranged to avoid large offset of the wafer. The offset of a wafer placed on the wafer supporting device is within a controllable and the allowable range. The wafer supporting device can be designed into different sizes according to different wafers, and has a wide range of application.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a wafer supporting device and a degassing process chamber. Background technique [0002] In the physical vapor deposition (PVD) manufacturing process of semiconductor integrated circuits, there are four processes: degassing, pre-cleaning, barrier layer film deposition, and seed layer film deposition. Among them, the function of the degassing process is to use the method of heating the wafer to remove water vapor or other volatile gases introduced by wet cleaning and the surrounding environment. It is a key process that affects the device yield. A good degassing process can get a good Film adhesion, good material integration, good temperature control. There are three heating methods for the existing degassing equipment: the bulb heat radiation type, the base heating type and the combination of the two. No matter which method is used, a thimble-like support mechanism is...

AI Technical Summary

Problems solved by technology

On the other hand, it is impossible for the machine to be adjusted to an absolute level in any factory, and the three thimbles 11 cannot be at an absolute level, and they will be more or less inclined, and the process chamber of the machine will use vacuum equipment such as a cold pump , when the vacuum equipment such as the cold pump is running, it will vibrate

Since the existing degassing process chamber only uses three thimbles 11 to support the wafer 2, the contact area between the thimbles 11 and the wafer 2 is very small. When the wafer 2 is heated, the coefficient of friction changes, so the vibration of the machine It will cause the wafer 2 to shift on the three-ejector mechanism, which may cause the wafer 2 shift to be too large during the process holding time, and the wafer 2 shift exceeds a certain range. Collision with the chamber wall or other parts may occur after being transferred out of chamber 1, or the wafer 2 may fall off on the robot arm when it is transferred out, and even cause the wafer to break

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