A high-power crimping type igbt package module fixture
A packaging module, crimping technology, applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the limited tensile force of ordinary metal insulating rods, the unsatisfactory heat dissipation effect of ordinary radiators, and the difficulty of applying force to the overall fixture and other problems, to achieve the best anti-oxidation and anti-corrosion performance, easy production and assembly, disassembly and maintenance, and low thermal expansion rate
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[0046] In order to better understand the present invention, the content of the present invention will be further described below in conjunction with the accompanying drawings and examples.
[0047] The present invention provides a high-power crimping type IGBT packaging module fixture, its three-dimensional structure diagram is as follows figure 1 As shown, it includes: upper fixture flange set, upper lead-out row 7, upper water-cooling heat dissipation set, middle lead-out row fixing block, lower water-cooling heat dissipation set, lower end lead-out row 11, lower load-bearing flange set, high-performance vertical Straight insulating support rod, radiator waterway assembly, wire channel assembly, capacitor assembly, damping resistance assembly, short circuit board 25, drive board 26;
[0048] The upper clamp set is longitudinally arranged on the upper surface of the upper lead-out row 7; the lower surface of the upper lead-out row 7 is longitudinally connected to the upper wa...
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