Semiconductor packaging structure and semiconductor technology

Abstract

The invention relates to a semiconductor packaging structure and semiconductor technology. the semiconductor packaging structure comprises a first substrate, a second substrate, a bare die, multiple inner connection elements, an adhesive film and a coating material, wherein the bare die is electrically connected with the first substrate; the inner connection elements are connected with the first substrate and the second substrate; the adhesive film is bonded on the second substrate and the bare die; the adhesive film is formed by a sheet film; and the coating material is located between the upper surface of the first substrate and the lower surface of the second substrate so as to coat the bare die, the adhesive film and the inner connection elements.

Description

technical field [0001] The invention relates to a semiconductor package structure and a semiconductor process. Specifically, the present invention relates to a stacked semiconductor package structure and semiconductor process thereof. Background technique [0002] The fabrication method of a conventional stacked semiconductor package structure is as follows. First, a die is bonded to the upper surface of a lower substrate. Next, an upper substrate is placed, and the upper substrate has a plurality of solder balls to be electrically connected to the upper surface of the lower substrate. Afterwards, a molding process is performed to form a sealing material between the upper and lower substrates. However, in this way, the solder balls need to be used as height control between the upper and lower substrates, so the solder balls need to use copper core tin balls to prevent the solder balls from melting due to solder balls. Lack of support leads to collapse. However, the cost ...

AI Technical Summary

Problems solved by technology

However, the cost of the copper core solder ball is higher than that of the solder ball, resulting in an increase in packaging cost

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