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A kind of hot-melt adhesive film for bonding metal and non-polar material and preparation method thereof

A technology of non-polar materials and hot-melt adhesive films, applied in adhesives, polymer adhesive additives, film/sheet adhesives, etc., can solve problems such as poor adhesion, poor peel strength, and degumming. Achieve the effect of long-lasting and stable bonding, high bonding strength and fast bonding speed

Active Publication Date: 2017-08-29
SHANGHAI TIANYANG HOT MELT ADHESIVE CO LTD +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Patent CN103059792B introduces a polyester elastomer hot-melt adhesive for bonding polar polymers and metal materials and its preparation method. Since this hot-melt adhesive has strong polarity, it is suitable for bonding non-polar materials The property is not strong, and its water resistance is relatively poor; Patent CN101429413B has introduced a kind of double-layer composite hot-melt adhesive film of metal and plastic bonding, but the adhesion between the upper and lower double-layer films of this hot-melt adhesive is poor, making It has low peel strength for metal and plastic; patent CN103756577A discloses a PVC / metal bonding hot-melt adhesive film and its preparation method, but the hot-melt adhesive has a short and unstable effect on metal bonding and adhesion, and is easy to Degumming from the metal, therefore, the overall peel strength is poor; patent CN101792641A discloses a kind of adhesive for aluminum alloy and PVC film, and this adhesive is a kind of fast curing adhesive, although shortening the drying time Dry solvent procedure, but the storage time of the adhesive is short, which brings inconvenience to practical application
[0004] In summary, the performance of existing hot melt adhesives in bonding metals and non-polar materials cannot meet industrial needs

Method used

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  • A kind of hot-melt adhesive film for bonding metal and non-polar material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Preparation of dimer acid type copolyamide: after mixing the dimer acid of 370g, the sebacic acid of 100g, the decanedidiamine of 57g, the hexamethylenediamine of 100g and the caprolactam of 65g, join in a mixer, thermometer and Add 50g of water to the 2L high-pressure reactor with a pressure gauge, replace it with nitrogen and evacuate to remove all the air in the reactor, then fill it with 0.2MPa high-purity nitrogen, heat it slowly to 230°C, at 1.0- Under the pressure of 1.2MPa, heat preservation reaction for 3 hours, slowly reduce the pressure to normal pressure, and continue to reduce the pressure to 0.05MPa for dehydration for 1 hour, discharge and pelletize to obtain granular dimer acid type copolyamide A. According to the national standard GB / T3682-2000, the DSC final melting point of the dimer acid type copolyamide A is 85°C and the melt flow rate is 50g / 10min / 160°C / 2.16kg.

[0032] Preparation of hot-melt adhesive film: 250g of dimer acid type copolyamide A, 3...

Embodiment 2

[0034] Preparation of dimer acid type copolyamide: After mixing 370g of dimer acid, 92.81g of dodecanedioic acid, 34.86g of 2,3-dimethylbutylene diamine, 90g of hexamethylenediamine and 90.27g of caprolactam , into a 2L high-pressure reactor with a stirrer, thermometer and pressure gauge, add 50g of water, replace with nitrogen and vacuumize, remove all the air in the reactor, and then fill it with 0.2MPa high-purity nitrogen , heating slowly to 230°C, under the pressure of 1.0-1.2MPa, heat preservation reaction for 3 hours, slowly reduce the pressure to normal pressure, and continue to depressurize to 0.05MPa for 1 hour, discharge and pelletize to obtain granular Dimer acid type copolyamide B. The DSC final melting point of the dimer acid-type copolyamide B was measured to be 89°C. According to the national standard GB / T3682-2000, the melt flow rate of the dimer acid-type copolyamide B was measured to be 46g / 10min / 160°C / 2.16kg.

[0035]Preparation of hot melt adhesive film: ...

Embodiment 3

[0037] Preparation of dimer acid type copolyamide: After mixing the dimer acid of 370g, the adipic acid of 48.28g, the hexamethylenediamine of 73.27g, the 2-methylpentamethylenediamine of 43.96g and the caprolactam of 73g, join in a belt In the high-pressure reaction kettle with agitator, thermometer and pressure gauge, add 50g of water, replace with nitrogen and evacuate, remove the air in the reaction kettle, then charge high-purity nitrogen of 0.2MPa, and heat up slowly to 230 ℃, under the pressure of 1.0-1.2MPa, heat preservation reaction for 3 hours, slowly reduce the pressure to normal pressure, and continue to depressurize to 0.05MPa after dehydration for 1 hour, discharge and pelletize to obtain granular dimer acid type copolyamide c. The DSC final melting point of the dimer acid-type copolyamide C was measured to be 85.5°C. According to the national standard GB / T3682-2000, the melt flow rate of the dimer acid-type copolyamide C was measured to be 48g / 10min / 160°C / 2.16k...

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Abstract

The invention provides a hot melt rubber film for adhering metal and non-polar material and a preparation method of the hot melt rubber film. The hot melt rubber film has the advantage that particular dimer acid copolyamide is prepared according to a corresponding proportion, the hot melt rubber combined with the particular dimer acid copolyamide has good adhering property to a metal material, a polyolefin elastomer has good adhering property to the non-polar material, and a proper amount of compatibilizing agent is added according to a particular ratio, so the prepared hot melt rubber and the rubber film have good compatibility, and the adhering strength of the hot melt rubber film with the metal and the non-polar material is greatly improved.

Description

technical field [0001] The invention relates to a hot-melt adhesive film for bonding metal and non-polar materials and a preparation method thereof. The hot-melt adhesive film prepared by the invention is mainly used for metal materials such as aluminum and stainless steel and non-polar materials such as PE and PP. Composite bonding of polar materials. Background technique [0002] The application of direct bonding of metal and plastic is becoming more and more widespread, especially the bonding of metal sheets and plastic sheets, which is more and more used in the electronics industry, machinery industry and construction industry. At present, it is mainly directly bonded by liquid glue such as epoxy glue and polyurethane glue. Liquid glue contains volatile substances, which is easy to pollute the environment and is inconvenient to process and operate. [0003] Hot melt adhesive does not contain solvents, has no pollution to the environment, and is convenient and quick to p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/00C09J177/00C09J123/08C09J11/08C09J11/06C08G69/36
Inventor 曾作祥马星全李哲龙朱万育
Owner SHANGHAI TIANYANG HOT MELT ADHESIVE CO LTD