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Chip electronic component and manufacturing method thereof

A technology of electronic components and manufacturing methods, applied in the direction of inductor/transformer/magnet manufacturing, coil manufacturing, electrical components, etc., can solve the problem of inductor inductance degradation and other issues

Active Publication Date: 2017-09-01
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as the thickness of the insulating layer increases, the volume occupied by the magnetic material decreases, so that defects such as deterioration of the inductance of the inductor occur

Method used

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  • Chip electronic component and manufacturing method thereof
  • Chip electronic component and manufacturing method thereof
  • Chip electronic component and manufacturing method thereof

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Embodiment Construction

[0035] Exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings.

[0036] This disclosure may, however, be embodied in many different forms and should not be construed as limited to the specific embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0037] In the drawings, the shapes and dimensions of elements may be exaggerated for clarity, and the same reference numerals will be used throughout to designate the same or like elements.

[0038] chip electronic components

[0039] Hereinafter, a chip type electronic component according to an exemplary embodiment of the present disclosure will be described. Specifically, a thin inductor will be described by way of example, but the present disclosure is not limited thereto.

[0040] figure 1 is a schematic pers...

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Abstract

The invention provides a chip electronic component and a manufacturing method thereof. In the chip electronic component, the thickness of an insulating layer which is formed on an outer inner coil can be different from that of the insulating layer which is formed on a core inner coil, so that loss coefficient and shortcircuit defect caused by leakage current can be prevented, and inductive deterioration of an inductor can be prevented.

Description

[0001] This application claims the benefit of Korean Patent Application No. 10-2014-0009430 filed in the Korean Intellectual Property Office on January 27, 2014, the disclosure of which is hereby incorporated by reference. technical field [0002] The present disclosure relates to a chip electronic component and a manufacturing method thereof. Background technique [0003] Inductors, one of chip electronic components, are representative passive devices that form electronic circuits together with resistors and capacitors to remove noise. Such inductors use electromagnetic properties in combination with capacitors to configure resonance circuits, filter circuits, and the like that amplify signals of a specific frequency band. [0004] Recently, as miniaturization and slimming of information technology (IT) devices such as various communication devices, display devices, etc. Research on techniques for miniaturization and thinning has been continuously conducted. Inductors are...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01F17/00H01F27/28H01F27/29H01F27/32H01F41/00H01F41/12
CPCH01F17/0013H01F27/292H01F27/324H01F27/33
Inventor 郑东晋李敬燮文炳喆
Owner SAMSUNG ELECTRO MECHANICS CO LTD