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Composite electronic assembly and board on which the composite electronic assembly is mounted

A technology for composite electronic components and printed circuit boards, which is applied in electrical components, transformer/inductor components, circuits, etc., and can solve problems such as Q factor degradation and self-resonant frequency shift.

Active Publication Date: 2018-02-02
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, in the case where the inductor and the capacitor are vertically arranged as described above, a parasitic capacitance is generated between the inductor and the capacitor so that the self-resonant frequency (SRF) shifts to a low frequency region
[0010] At the same time, according to the miniaturization of composite electronic components, the inner magnetic layer that blocks the magnetic field of the inductor is also thinned, resulting in deterioration of the Q factor

Method used

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  • Composite electronic assembly and board on which the composite electronic assembly is mounted
  • Composite electronic assembly and board on which the composite electronic assembly is mounted
  • Composite electronic assembly and board on which the composite electronic assembly is mounted

Examples

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Embodiment Construction

[0047] Exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings.

[0048] This disclosure may, however, be embodied in many different forms and should not be construed as limited to the specific embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0049] In the drawings, the shapes and dimensions of elements may be exaggerated for clarity, and the same reference numerals will be used throughout to designate the same or like elements.

[0050] Composite Electronic Components

[0051] Figure 1A and Figure 1Bare perspective views each schematically showing composite electronic components according to exemplary embodiments of the present disclosure.

[0052] figure 2 is shown taken along line A-A' Figure 1B Cross-sectional view of a first example of a com...

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PUM

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Abstract

Provided are a composite electronic component and a board mounted with the composite electronic component. The composite electronic component may include: a composite body having a capacitor and an inductor combined with each other in the composite body; input terminals provided on a first end surface, a first side surface, and a second side surface of the composite body; output terminals including The first output terminal arranged on the second end surface, the first side surface and the second side surface of the composite body and the second output terminal arranged on the second side surface of the composite body; the ground terminal is arranged on the composite body on the first side surface. When the length of the composite body is defined as L and the width of the input terminal along the length direction of the composite body is defined as a, a / L is in the range of 0.05 to 0.30, the capacitor and the inductor are vertically combined with each other, and the magnetic sheet Inserted between the inductor and capacitor.

Description

[0001] This application claims the benefit of Korean Patent Application No. 10-2014-0009383 filed with the Korean Intellectual Property Office on Jan. 27, 2014, the contents of which are hereby incorporated by reference. technical field [0002] The present disclosure relates to a composite electronic component including a plurality of passive components and a board on which the composite electronic component is mounted. Background technique [0003] According to the recent trend toward compact and slim electronic devices and high functionality of electronic devices, there has been a demand for miniaturized and multifunctional electronic devices. [0004] The electronic device as described above may include a power semiconductor based power management integrated circuit (PMIC) for efficiently controlling and managing limited battery resources to meet various service demands. [0005] However, since electronic devices have multiple functions, the number of direct current (DC)...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H02M1/44
CPCH02M1/00H02M3/00H01F27/2804H01G2/06H01G4/40H03H7/0115
Inventor 申东辉崔才烈金基源
Owner SAMSUNG ELECTRO MECHANICS CO LTD