Heat dissipation structure and electronic device with the heat dissipation structure

Abstract

The invention provides a heat dissipation structure. The heat dissipation structure comprises a housing and a heat dissipation fan, wherein a first air suction opening, a second air suction opening and an air discharging opening are formed in the housing; the heat dissipation fan is arranged in the housing and is used for driving airflow to enter the housing from the first air suction opening and the second air suction opening and discharge from the air discharging opening; or the heat dissipation fan is used for driving the airflow to enter the housing from the air discharging opening and discharging from the first air suction opening and the second air suction opening respectively. According to the heat dissipation structure, two air suction opening and one air discharging opening are formed in the structure to form a two-channel heat dissipation layout, so that the heat in the housing can be discharged thoroughly; the heat dissipation efficiency is improved; a heat pipe radiator does not need to be arranged, so that the heat dissipation structure is relatively simple in structure and relatively low in cost. The invention further provides an electronic device comprising the heat dissipation structure.

Description

technical field [0001] The invention relates to the technical field of heat dissipation, in particular to a heat dissipation structure and an electronic device with the heat dissipation structure. Background technique [0002] At present, electronic products with high heat flux, such as camera gimbals, are provided with heat dissipation structures to dissipate heat from chips in the electronic products, thereby ensuring the normal operation of the electronic products. The traditional heat dissipation structure usually adopts the way of fan heating pipe, specifically: using the high thermal conductivity of the heat pipe to quickly conduct the heat of the chip to the remote heat sink, and then use the forced convection heat exchange such as fan blowing the heat sink to transfer the heat on the heat sink. The heat is dissipated, so as to achieve the purpose of reducing the chip temperature. However, due to the complex processing technology of the heat pipe radiator, the cost i...

AI Technical Summary

Problems solved by technology

However, due to the complex processing technology of the heat pipe radiator, the cost is much higher than that of ordinary radiators

At the same time, in order to dissipate the heat, the heat sink at the far end is often densely packed, which inevitably leads to a relatively large wind resistance of the fan blowing through the heat sink, resulting in relatively high noise of the product

Images