An automatic sampling inspection equipment for smd trays

Abstract

The invention discloses high-efficiency automatic sampling inspection equipment for SMD material tray, which is characterized in that the sampling inspection equipment comprises a material belt positioning unit, a detecting unit, a pickup unit and a component box; wherein the material belt positioning unit is used for fixing and positioning the material belts with different widths; the components on the material belt are picked through the pickup unit; furthermore the components are transferred to the detecting unit in high precision for realizing quick inspection for component parameters; and afterwards, successively placing the components after inspection into the component box. The high-efficiency automatic sampling inspection equipment can realize quick automatic sampling inspection on rolled SMD material trays, and has advantages of high-efficiency inspection, simple structure, convenient use, etc.

Description

technical field [0001] The invention belongs to the related field of SMD component detection equipment, and more specifically relates to an automatic sampling inspection equipment for SMD material trays. Background technique [0002] With the rapid development of the information industry revolution, the demand for electronic components is increasing day by day. Electronic components are the smallest unit of electronic products and the basis of the reliability of the whole machine. With the development of modern science and technology, the complexity of electronic equipment and systems is getting higher and higher, and the number of electronic components required is also increasing. According to reliability theory, the more components and parts make up the system, the lower the reliability of the system is under the condition that the reliability index of components and parts remains unchanged. [0003] Especially, for electronic components such as Surface Mounted Devices (S...

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Problems solved by technology

[0004] Although some sampling inspection schemes for SMD trays have been proposed in the prior art, further research shows that there are still many problems to be solved: for example, the detection method is relatively simple, basically one station or a set of equipment can only detect one parameters; and the structure of the overall equipment is often very complex and expensive, which leads to an increase in equipment investment when building a multi-parameter detection line for electronic components, and the detection efficiency is also greatly increased due to the greatly increased auxiliary time for loading and unloading components. reduce

In addition, at present, most domestic electronic component manufacturing enterprises are still in the labor-intensive production mode. The quality inspection of each process in the product manufacturing process usually uses manual inspection. This method is labor-intensive, costly, and has a high false detection rate. Low detection efficiency seriously affects production efficiency

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