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Semiconductor liquid-cooling radiator

A liquid-cooled heat dissipation and semiconductor technology, which is applied in the direction of semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc., to achieve the effects of heat dissipation, strong adjustability, and simple structure

Inactive Publication Date: 2015-08-19
UNIV OF SHANGHAI FOR SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] However, there is currently no heat sink that uses semiconductor refrigeration to obtain a cold source combination that can be used for cooling high-power electronic components, and uses liquid cooling to dissipate heat from the hot end of the semiconductor refrigeration device.

Method used

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  • Semiconductor liquid-cooling radiator

Examples

Experimental program
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Effect test

Embodiment Construction

[0023] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0024] like figure 1 As shown, a semiconductor liquid-cooled heat dissipation device includes heat insulating material 1, high-power electronic components 2, heat-conducting adhesive 3, auxiliary heat-conducting material 4, semiconductor refrigeration device 5, liquid cooling plate 6, water outlet pipe 7, water inlet pipe 8, Small water pump 9, liquid cooling radiator 10, cooling fan 11.

[0025] The cold end of the semiconductor refrigeration device 5 is placed on the high-power electronic component 2 for cooling and cooling of the high-power electronic component 2; the hot end of the semiconductor refrigeration device 5 is connected to a liquid cooling device, and the liquid cooling device is used for cooling and cooling. The cold end of the semiconductor refrigeration device 5 is connected to the heating surface of the high-power electronic componen...

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Abstract

The invention relates to a semiconductor liquid-cooling radiator, which comprises a semiconductor refrigeration device and a liquid-cooling radiator, wherein a cold end of the semiconductor refrigeration device is arranged on a high-power electronic component, and is used for cooling the high-power electronic component; and a hot end of the semiconductor refrigeration device is connected with the liquid-cooling radiator, and is cooled through the liquid-cooling radiator. The semiconductor liquid-cooling radiator utilizes a semiconductor refrigeration technology for cooling the high-power electronic component, and cools the hot end of the semiconductor refrigeration device through the liquid-cooling radiator, so as to meet the cooling requirement of high-power electronic equipment.

Description

technical field [0001] The invention relates to a heat dissipation device for high-power electronic components, in particular to a cooling method that utilizes a combination of semiconductor refrigeration and liquid cooling to dissipate heat, and can provide a heat dissipation device with good cooling effect for high-power electronic components. Background technique [0002] With the development of the global information age, the use of electronic equipment is becoming more and more extensive. High-power electronic components also generate a lot of heat while running, and long-term operation of electronic components in a high-temperature environment will reduce their work efficiency and service life. Choosing a reasonable heat dissipation method for electronic components can greatly improve their performance. [0003] Commonly used cooling methods for high-power electronic components include natural convection cooling, forced convection cooling, liquid cooling, cooling by re...

Claims

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Application Information

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IPC IPC(8): H01L23/38H01L23/473
Inventor 吕静李昶王太晟常明涛李宁赵琦昊
Owner UNIV OF SHANGHAI FOR SCI & TECH
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