7results about How to "Meet the cooling effect" patented technology

The invention provides a cooling system for a transformer radiator. The cooling system comprises a spraying cooling device composed of a main pipeline, a first auxiliary pipeline, a water valve, a top spray head and a side wall spray head. The main pipeline is mounted below the radiator, one end is a water inlet, the other end is sealed, and a first mounting hole is formed in the middle; any two first auxiliary pipelines are separated by at least one radiating fin on the radiator; the first auxiliary pipeline is located between the two cooling fins, one end of the first auxiliary pipeline is installed in the corresponding first installation hole and communicated with the first installation hole, the other end of the first auxiliary pipeline is located above the radiator and provided with a top sprayer, and a side wall sprayer is installed in the middle of the first auxiliary pipeline. Each top spray head is provided with at least one group of first water spray holes arranged in the radial direction; at least one group of second water spraying holes which are formed in the axial direction are formed in each side wall spraying head; the water valve is arranged on the main pipeline and close to the water inlet. According to the invention, not only is the spraying cooling effect improved, but also an intelligent control function is realized to enhance the practicability, so that the waste of resources and manpower is reduced.

The invention discloses a temperature drop control method and a temperature drop control system. The temperature drop control method comprises the following steps: determining a temperature value of a to-be-cooled part; under the condition that the temperature value is larger than a first threshold value, a cooling device is controlled to work at preset power, and the first threshold value is larger than a preset value; under the condition that the temperature value is smaller than the first threshold value and larger than the preset value, the cooling device is controlled to be switched from the preset power to the first power to work, and the first power is smaller than the preset power; and under the condition that the temperature value is equal to or smaller than a preset value, controlling the cooling device to stop working. According to the temperature drop control method, the problem that the process effect of a part of silicon wafers is poor due to the fact that the temperature drop of the part of silicon wafers cannot meet the requirement when the current silicon wafers are all cooled based on the same cooling standard can be solved.

The utility model provides a memory heat dissipation module which comprises a heat dissipation assembly composed of a front plate and a back plate, the front plate and the back plate form a cavity structure comprising a phase change area and a backflow area in a welding mode, the lower portion of a vacuum cavity is filled with phase change media, and the phase change media can be transferred to the upper backflow area after being heated. According to the utility model, the vacuum cavity is divided into a plurality of backflow channels by the support bumps, the heat dissipation teeth and the heat dissipation through holes covering the surfaces of the support bumps are formed on the front plate through a stamping process, heat of the support bumps can be transmitted to the heat dissipation teeth and the heat dissipation through holes without any obstruction, and the heat dissipation capability is improved while the front plate is supported. According to the embodiment of the invention, a structure for clamping the memory by the two groups of heat dissipation assemblies is provided, and the whole heat dissipation device is divided into an upper air cooling area and a lower clamping area, so that the installation of the memory is not influenced. The utility model can satisfy the radiating effect of 30W power consumption of the memory, and is particularly suitable for the memory of a data center / server / intelligent chip.

The utility model relates to a built-in cooling coil pipe which comprises a speed reducer shell, a coil pipe body and a connecting assembly, the coil pipe body and the connecting assembly are arranged in the speed reducer shell, a connector of the coil pipe body is fixedly connected with the connecting assembly, an installation hole is formed in the speed reducer shell, and the connecting assembly comprises a flange and a flaring type pipe connector. One end of the flaring type pipe joint is fixedly connected with the joint of the coil pipe main body, and the other end of the flaring type pipe joint sequentially penetrates through the mounting hole of the speed reducer shell, the sealing ring and the flange and then is fixed on the speed reducer shell through the hexagonal thin nut. A special cold area coil pipe structural design is adopted, a cooling coil pipe is placed in a box body, a gear in the box body is avoided, a motor pump and an external plate heat exchanger are omitted, a transition connector is installed in the box body, and the other end of the cooling coil pipe is installed in a concave position of the box body through a special cooling coil pipe structure, so that the stability of the device is guaranteed, and the service life of the device is prolonged. Finally, the purposes of cooling effect, low noise, light weight and small size are achieved.

The invention relates to a refrigerating system for a shield tunneling machine and the shield tunneling machine. The refrigerating system for the shield tunneling machine comprises a first heat exchanger and a second heat exchanger, a refrigerating medium flows through the main circulation pipeline, and a compressor, a first heat exchanger and a steam-water separator are sequentially arranged on the main circulation pipeline; the main circulation pipeline is connected with a first cooling loop and a second cooling loop which are connected in parallel, the first cooling loop is provided with at least one first heat production device, the second cooling loop is provided with at least one second heat production device, and the heat production rate of the first heat production device is larger than that of the second heat production device. The shield tunneling machine cooling system solves the technical problems that an existing shield tunneling machine cooling system is poor in applicability to underground working environments and equipment, and refrigeration cannot be continued under the power failure condition.

The utility model relates to the technical field of hydrogen fuel cell power system heat dissipation, and discloses a power system heat dissipation structure of a hydrogen fuel cell aircraft, which comprises an upper power cover, the lower surface of the upper power cover is fixedly connected with a lower power cover, and the inner walls of the left upper side and the right upper side of the lower power cover are provided with motor cooling ventilation openings. A DC-DC cooling ventilation opening is formed in the lower side of the power lower cover, a seat ventilation assembly is arranged on the inner wall of the power lower cover, and the seat ventilation assembly is used for improving comfort in the driving process. According to the utility model, the power upper cover and the power lower cover are used as a whole and are provided with a plurality of ventilation openings, including a charging opening cover, a motor cooling ventilation opening, a cabin ventilation opening, a cabin ventilation pipe, an electric control cooling ventilation opening, a hydrogen fuel cell cooling ventilation opening and a motor auxiliary ventilation cooling opening, so that different parts can be cooled by different airflow channels; the structure is simple, heat dissipation can be conducted on a power system, and ventilation can be conducted on a manned cabin.