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3results about How to "Meet the cooling effect" patented technology
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Temperature drop control method and temperature drop control system
The invention discloses a temperature drop control method and a temperature drop control system. The temperature drop control method comprises the following steps: determining a temperature value of a to-be-cooled part; under the condition that the temperature value is larger than a first threshold value, a cooling device is controlled to work at preset power, and the first threshold value is larger than a preset value; under the condition that the temperature value is smaller than the first threshold value and larger than the preset value, the cooling device is controlled to be switched from the preset power to the first power to work, and the first power is smaller than the preset power; and under the condition that the temperature value is equal to or smaller than a preset value, controlling the cooling device to stop working. According to the temperature drop control method, the problem that the process effect of a part of silicon wafers is poor due to the fact that the temperature drop of the part of silicon wafers cannot meet the requirement when the current silicon wafers are all cooled based on the same cooling standard can be solved.
Owner:BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
Internal memory heat dissipation module
ActiveCN224263589UMeet the cooling effectImprove cooling effectDigital processing power distributionThermodynamicsTerm memory
The utility model provides a memory heat dissipation module which comprises a heat dissipation assembly composed of a front plate and a back plate, the front plate and the back plate form a cavity structure comprising a phase change area and a backflow area in a welding mode, the lower portion of a vacuum cavity is filled with phase change media, and the phase change media can be transferred to the upper backflow area after being heated. According to the utility model, the vacuum cavity is divided into a plurality of backflow channels by the support bumps, the heat dissipation teeth and the heat dissipation through holes covering the surfaces of the support bumps are formed on the front plate through a stamping process, heat of the support bumps can be transmitted to the heat dissipation teeth and the heat dissipation through holes without any obstruction, and the heat dissipation capability is improved while the front plate is supported. According to the embodiment of the invention, a structure for clamping the memory by the two groups of heat dissipation assemblies is provided, and the whole heat dissipation device is divided into an upper air cooling area and a lower clamping area, so that the installation of the memory is not influenced. The utility model can satisfy the radiating effect of 30W power consumption of the memory, and is particularly suitable for the memory of a data center / server / intelligent chip.
Owner:KUNSHAN YINGFAN PRECISION METAL
Generator set and internal heat dissipating device for generator set
Owner:AKSA POWER GENERATION (CHINA) CO LTD