Design method of novel Purley CPU radiator

A design method and heat sink technology, applied in computer-aided design, design optimization/simulation, instruments, etc., can solve the problems of lack of heat dissipation requirements for evaluating heat sinks, difficult heat sinks, etc., to improve selection efficiency, reduce design costs, EFFECT OF SIMPLIFYING THE SELECTION AND EVALUATION PROCESS

Inactive Publication Date: 2017-10-24
ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
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  • Description
  • Claims
  • Application Information

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Problems solved by technology

Of course, as the Purley CPU has many types of heat generation and power consumption, how to evaluate the type of CPU supported by the designed heat sink is a relatively difficult pr

Method used

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  • Design method of novel Purley CPU radiator

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Embodiment 1

[0019] combine figure 1 , a design method of a novel Purley CPU heat sink, comprising the following steps:

[0020] Obtain the ventilation rate of the scene, and check the table to obtain the thermal resistance Rca value of the radiator;

[0021] Select a certain CPU model, look up the table to obtain the power consumption value, and look up the table to obtain the maximum surface temperature Tcmax value (or Tcasemax) allowed by the CPU;

[0022] The product of the thermal resistance Rca value of the radiator and the power consumption value is used as the CPU surface temperature Tc value in the scenario;

[0023] Compare the CPU surface temperature Tc value with the maximum CPU surface temperature Tcmax value; if the CPU surface temperature Tc value ≤ the CPU maximum surface temperature Tcmax, confirm that the radiator can support the CPU model, if the CPU surface temperature Tc value > and The maximum surface temperature Tcmax allowed by the CPU. Confirm that the CPU model ...

Embodiment 2

[0027] The thermal resistance Rca value of the radiator is obtained through actual measurement: through the wind tunnel test equipment, a physical scene is established. In the physical scene, a real CPU or a heating block is placed under the radiator, and the temperature of the radiator is monitored by controlling the power consumption of the CPU or heating block. Change, calculate Rca; through the wind tunnel analysis of the heat sink structure, combined with the ventilation volume of the application scene, confirm the range of the heat dissipation of the CPU supported by the heat sink. For other references to Embodiment 1, details are not repeated here.

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Abstract

The invention discloses a design method of a novel Purley CPU radiator. The design method comprises the following steps that the ventilation amount of a scene is obtained, and a thermal resistance Rca value of the radiator is obtained through a look-up table; a certain CPU model is selected, a power consumption value is obtained through a look-up table, and the maximum surface temperature Tcmax value allowed by a CPU is obtained through a look-up table; the product of the thermal resistance Rca value and the power consumption value of the radiator serves as a CPU surface temperature Tc value under the scene; the CPU surface temperature Tc value is compared with the maximum surface temperature Tcmax value allowed by the CPU; if the CPU surface temperature Tc value is smaller than or equal to the maximum surface temperature Tcmax allowed by the CPU, it is confirmed that the radiator can support the CPU model, and if the CPU surface temperature Tc value is larger than the maximum surface temperature Tcmax allowed by the CPU, the steps need to be repeated to select a low-specification CPU model again. According to the method, the CPU power consumption level which can be supported by the design of the radiator can be evaluated in advance through analysis, the efficiency is high, and the design cost can be reduced.

Description

technical field [0001] The invention relates to the technical field of internal cooling and heat dissipation of servers, in particular to a novel Purley CPU radiator design method. Background technique [0002] With the development of CPU technology, its function / integration density is getting stronger and stronger, and its heating power consumption is also gradually increasing. Many CPUs currently used in the computer industry, such as the current latest version of the Purley platform CPU in the existing technology, are increasingly used. Widely, the maximum power consumption of the latest version of Intel Purley CPU has reached above 250W / chip. Especially considering the wide application of Intel Purley CPU, the design of Purley CPU cooler becomes more and more important. Of course, as the Purley CPU has many types of heat generation and power consumption, how to evaluate the type of CPU supported by the designed heat sink is a relatively difficult problem. There is also ...

Claims

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Application Information

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IPC IPC(8): G06F1/20G06F17/50
CPCG06F1/20G06F30/20G06F2111/20G06F2119/06G06F2119/08
Inventor 刘广志
Owner ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
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