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46results about How to "No added bulk" patented technology

High-resistance surface metamaterial waveguide slot antenna

The invention discloses a high-resistance surface metamaterial waveguide slot antenna. The metamaterial waveguide slot antenna comprises a metamaterial waveguide tube and a radiation gap, wherein the metamaterial waveguide tube comprises a metal waveguide tube and a dielectric plate, the metal waveguide tube is a through tube with a rectangular cross section, the radiation gap is arranged in an upper surface of the metal waveguide tube, one end of the metal waveguide tube is opened and is used as a signal input port, the other end of the metal waveguide tube is closed and is in a short-circuit state, the dielectric plate is arranged on a wide edge of a lower part of an inner wall of the metal waveguide tube along a length direction, a periodic pattern is etched on a surface of the dielectric plate. By the antenna, low-loss radiation can be achieved in a working frequency band, and the antenna is high in efficiency; and by the antenna, dual-band suppression outside the working frequency band can be achieved, the characteristic of the antenna is equivalent to that of a high-pass filter when electromagnetic interference of a low frequency band is suppressed, and the characteristic of the antenna is equivalent to that of a band rejection filter when electromagnetic interference of a high frequency band is suppressed.
Owner:CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST

Normal temperature bonding technology-based microminiature fuel cell encapsulation method

The invention discloses a normal temperature bonding technology-based microminiature fuel cell encapsulation method, which belongs to the technical field of processing and systems of microfluids and micromachining. A polar plate surface after being processed by oxygen plasma is bonded to a flow field sealing washer of a micro-proton exchange membrane fuel cell (PEMFC) so as to realize ordered assembly of a cell component by bonding or using a solid adhesive tape. A boding interface between a silicon polar plate and the flow field sealing washer and an adhesive on the solid adhesive tape provide a pressure required for fastening the cell component. A layer of diaphragm seal is deposited on the surface of the cell body of the micro-PEMFC to realize complete sealing of the micro-PEMFC and achieve an effect on protecting the cell body. The method reduces moveable components in the cell body, reduces difficulties in encapsulation, avoids performance reduction of a proton exchange membrane because of the damage which is caused by high-temperature dehydration, avoids the pollution to MEA and other cell components, does not need to use a positioning clamp for clamping, does not increase cell device volume, and simultaneously ensures the reliability of a cell.
Owner:TSINGHUA UNIV

Normal temperature bonding technology-based microminiature fuel cell encapsulation method

The invention discloses a normal temperature bonding technology-based microminiature fuel cell encapsulation method, which belongs to the technical field of processing and systems of microfluids and micromachining. A polar plate surface after being processed by oxygen plasma is bonded to a flow field sealing washer of a micro-proton exchange membrane fuel cell (PEMFC) so as to realize ordered assembly of a cell component by bonding or using a solid adhesive tape. A boding interface between a silicon polar plate and the flow field sealing washer and an adhesive on the solid adhesive tape provide a pressure required for fastening the cell component. A layer of diaphragm seal is deposited on the surface of the cell body of the micro-PEMFC to realize complete sealing of the micro-PEMFC and achieve an effect on protecting the cell body. The method reduces moveable components in the cell body, reduces difficulties in encapsulation, avoids performance reduction of a proton exchange membrane because of the damage which is caused by high-temperature dehydration, avoids the pollution to MEA and other cell components, does not need to use a positioning clamp for clamping, does not increase cell device volume, and simultaneously ensures the reliability of a cell.
Owner:TSINGHUA UNIV

Current transformer based on active-compensation external magnetic field

The invention relates to a current transformer based on an active-compensation external magnetic field. The technical characteristics are as follows: two pairs of measurement windings and compensation windings orthogonal to each other, namely, a measurement winding and a compensation winding in the X-axis direction and a measurement winding and a compensation winding in the Y-axis direction, are wound outside the current transformer; the two pairs of measurement windings and compensation windings are equal in number of turns and opposite in direction; and the two pairs of measurement windings and compensation windings respectively constitute an external magnetic field active compensation circuit in the X-axis direction and an external magnetic field active compensation circuit in the Y-axis direction. According to the invention, two pairs of measurement windings and compensation windings orthogonal to each other are wound outside the current transformer. Through the external magnetic field active compensation circuit between the two windings, the influence of an external magnetic field can be compensated actively. Therefore, the work error of the current transformer caused by the influence of an external magnetic field is reduced greatly, the stability of the current transformer is improved, the immunity to interference of an external magnetic field and precision of equipment are improved, and the effect of magnetic shielding is improved greatly.
Owner:国网天津节能服务有限公司 +3

Active fault-tolerant control method for electric control suspension system of whole vehicle

The invention discloses an active fault-tolerant control method for an electric control suspension system of a whole vehicle. The method is based on fault diagnosis and fault-tolerant control technologies, is applied to a general electric control suspension system, and comprises the following steps: (1) establishing a kinetic model of the electric control suspension system of the whole vehicle; (2) performing active fault-tolerant control when a sensor system fails; (3) adopting a hybrid control strategy of an electric control suspension controller considering vehicle driving smoothness and handling stability; (4) judging whether an actuator and the controller of an electric control suspension system break down at the same time; (5) giving an alarm when the controller breaks down; and (6) performing active fault-tolerant control when the actuator breaks down. According to the invention, active fault-tolerant control can be realized when the sensor, the actuator and the controller in the electric control suspension of the whole vehicle fail, so that the reliability of an electric control suspension system of a vehicle provided with the electric control suspension can be effectively enhanced, and switching of riding comfort and handling stability can be completed according to actual needs.
Owner:HEFEI UNIV OF TECH

Electromagnetic interference control device for vehicle-mounted generator control system

The invention discloses an electromagnetic interference control device for a vehicle-mounted generator control system, which is characterized by comprising at least one filter, a base and an anti-magnetic shielding cover, wherein the at least filter is selected from the following filters: a three-phase input filter which is connected between a generator and a generator controller, a RS232 signal filter which is connected between the generator controller and a control panel, a one-way output filter which is connected between the generator controller and a vehicle-mounted power source, a direct-current input filter which is connected between the generator controller and a vehicle jar, and an excitation output filter which is connected between the generator controller and the generator; the base is used for placing the filter and the generator controller; and the anti-magnetic shielding cover is covered on the base. The invention can solve the interference problem simultaneously in two ways of radiation and filtration without changing original generator control input / output signals or increasing engine loads, thereby eliminating the influence of the vehicle-mounted generator system on vehicle-mounted short-wave communication.
Owner:BEIJING ZHONGSHI ZHENGQI TECH CO LTD

Balanced Pair Tovivaldi Antenna Using Asymmetric Dielectric Rejection and Hybrid Slot

The invention discloses a balance antipodal Vivaldi antenna adopting unsymmetrical medium rejection and mixed grooving and relates to the field of antennas. While low cross polarization of a traditional balance antipodal Vivaldi antenna is kept as an advantage, the problem that due to asymmetry of the traditional balance antipodal Vivaldi antenna, a main lobe of the E face of the antenna deviates is solved. Each floor metal layer is attached to the lower surface of a medium substrate layer, a conductor metal layer is attached to the upper surface of the lower medium substrate layer, the conductor metal layer and the floor metal layers extend to the two sides respectively to form metal arms, the metal arms formed by the floor metal layers and the metal arm formed by the conductor metal layer are symmetrical in structure, the outer sides and the inner sides of the metal arms are of curve structures, the lower medium substrate layer located between the curve on the inner side of the conductor metal layer and the curve on the inner side of the lower floor metal layer is rejected, and the rejected lower medium substrate layer is provided with one more medium section compared with the curves on the inner sides of the floor metal layers. The balance antipodal Vivaldi antenna is used for working within the working frequency of 10-40 GHz.
Owner:HARBIN INST OF TECH

Semiconductor device heat dissipation structure and preparation method thereof

The invention discloses a semiconductor device heat dissipation structure and a preparation method thereof, the semiconductor device heat dissipation structure comprises a composite shell and a heat pipe arranged in the composite shell, and the composite shell comprises an integrated structure formed by sequentially superposing a heat absorption material layer, a transition material layer and a heat dissipation material layer; the transition material layer is formed by mutual diffusion of atoms of the heat absorption material layer and the heat dissipation material layer, a device installation part is arranged on the surface, located on one side of the heat absorption material layer, of the composite shell, the bottom face of the device installation part is used for arranging a semiconductor device, and a cavity used for circulation of a cooling medium is formed in the heat dissipation material layer, the composite shell and the pipe wall of the heat pipe are of an integrated structure, and the side, opposite to the bottom face of the device installation part, of the heat pipe extends towards the interior of the cavity. The semiconductor device heat dissipation structure is of an integrated structure and is not provided with a contact interface with high thermal resistance, heat generated by the semiconductor device can be rapidly dissipated through multiple heat dissipation means, the size of the semiconductor device heat dissipation structure is not increased, and the requirement of a miniaturized device can be met.
Owner:度亘核芯光电技术(苏州)有限公司

A transfer transistor structure

A transmission transistor structure capable of enhancing signals output by a CMOS image sensor comprises a photodiode, a P-type silicon substrate, a drain terminal, an insulating layer, a polycrystalline silicon grid, a conductive channel and a heavily-doped region. The photodiode of a transmission transistor serves as a single photo-electric conversion diode and is responsible for converting optical signals to electric signals, and meanwhile, the photodiode of the transmission transistor also serves as the source end of the transmission transition responsible for electron transmission in the structure of the CMOS image sensor and is directly connected with the transmission transistor. The heavily-doped region with the junction depth being 0.12-0.18 micrometer is formed at the position, close to the polycrystalline silicon grid of the transmission transistor, of the photo diode through ion implantation, and the injected doping ion concentration is higher than the originally-injected doping ion concentration of the photodiode. According to the transmission transistor structure, when the CMOS image sensor outputs signals, the phenomenon that the conductive channel is pinched off too early can be avoided, photoelectrons are transmitted out as many as possible, and therefore the output strength of electric signals of the CMOS image sensor is enhanced.
Owner:SHANGHAI HUALI MICROELECTRONICS CORP

A semiconductor device heat dissipation structure and its preparation method

A heat dissipation structure of a semiconductor device and a preparation method thereof. The heat dissipation structure of a semiconductor device includes a composite casing and a heat pipe arranged in the composite casing. Integral structure, the transition material layer is formed by mutual diffusion of atoms in the heat-absorbing material layer and the heat-dissipating material layer, a device mounting part is provided on the surface of the composite shell on the side of the heat-absorbing material layer, and the bottom surface of the device mounting part is used for setting In the semiconductor device, a cavity for circulating cooling medium is formed in the heat dissipation material layer, the composite shell and the tube wall of the heat pipe are integrally structured, and the heat pipe is located on the side opposite to the bottom surface of the device mounting part and extends toward the cavity. The heat dissipation structure of the semiconductor device is an integrated structure, there is no contact interface with high thermal resistance, and various heat dissipation methods can quickly dissipate the heat generated by the semiconductor device without increasing the volume of the heat dissipation structure of the semiconductor device, which can meet the needs of miniaturized devices.
Owner:度亘核芯光电技术(苏州)有限公司
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