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Heat dissipation cover plate and chip

A heat dissipation cover and chip technology, applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of long heat dissipation channel path and poor heat dissipation effect, and achieve the effect of enhanced heat dissipation effect, increased quantity, and reduced junction temperature

Pending Publication Date: 2021-11-09
XI AN UNIIC SEMICON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the problem that the heat dissipation channel path of the 3DIC packaging structure in the prior art is long, resulting in poor heat dissipation effect, the present invention proposes a heat dissipation cover plate and a chip

Method used

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  • Heat dissipation cover plate and chip
  • Heat dissipation cover plate and chip
  • Heat dissipation cover plate and chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] see image 3 , a chip in this embodiment, which includes a chip body 3, a PCB board 9 and a heat dissipation cover, the chip body 3 is placed on the upper surface of the PCB 9, and the heat dissipation cover includes a cover body 1, which is arranged at the bottom of the heat dissipation body 1 There is a groove, and an accommodating groove is formed between the groove and the PCB board 9; the chip body 3 is arranged in the accommodating groove, and the chip body 3 is in contact with the cover body 1; the bottom end surface of the cover body 1 is in contact with the PCB board 9 The upper end surface of the chip body contacts and forms a second heat dissipation surface 102, and the second heat dissipation surface 102 is used to transfer the heat generated by the chip body 3 to the PCB board 9, that is, between the chip body 3-the second heat dissipation surface 102-the PCB board 9 A heat dissipation channel is formed; wherein, the width of the second heat dissipation sur...

Embodiment 2

[0071] see Figure 4 , a chip in this embodiment. The difference from Embodiment 1 is that the width of the first heat dissipation surface 101 in this embodiment is 4mm; the width of the second heat dissipation surface 102 is 10mm; the third heat dissipation surface 103 is connected to the chip body The contact area between the back surfaces of 3 is the same as the area of ​​the back surface of the chip body 3 .

[0072] The heat dissipation adhesive layer 4 coated on the back side of the chip body 3 has a thickness of 0.1mm.

[0073] The 80 metal bumps 2 between the front surface of the chip substrate 3 and the substrate 6 are arranged side by side between the 80 metal bumps 2 .

[0074] 80 metal bumps 2 are evenly distributed in the underfill adhesive layer 5, and the front of the chip substrate 3 is electrically connected to the substrate 6 through 50 metal bumps 2; The metal bump 2 and the upper surface of the substrate 6 are fixedly bonded.

[0075] All the other are i...

Embodiment 3

[0077] see figure 2 , the present embodiment is a heat dissipation cover plate, which includes a cover plate body 1, the upper end surface of the cover plate body 1 is rectangular, the bottom of the cover plate body 1 is a plane, and a groove is arranged on the bottom wall of the cover plate body 1. The bottom wall of the groove is a planar structure, the bottom wall of the groove is a planar structure, and the side wall in the groove is integrally fixedly connected with a raised part along the axial direction of the cover body 1, and the raised part is a stepped structure, The lower end surface of the protrusion is a plane; the axial direction of the cover body 1 refers to the direction extending backward along one end of the cover body 1 .

[0078] In particular, it should be noted that: preferably, in this embodiment, protrusions can be integrally provided on the two opposite side walls of the groove, the protrusions on the two side walls are directly opposite to each othe...

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PUM

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Abstract

The invention provides a heat dissipation cover plate and a chip, and belongs to the technical field of integrated circuit packaging. The chip comprises a chip body, a PCB and a heat dissipation cover plate arranged on the PCB. The heat dissipation cover plate comprises a cover plate body, the cover plate body is provided with a groove, and the groove and the PCB form an accommodating groove. The chip body is arranged in the accommodating groove and is in contact with the cover plate body. The cover plate body is in contact with the PCB to form a second heat dissipation surface, and the second heat dissipation surface is used for transmitting heat generated by the chip body to the PCB. According to the chip, the heat dissipation path of the chip is changed, the heat dissipation effect is improved, and the maximum junction temperature of the chip is reduced.

Description

technical field [0001] The invention belongs to the technical field of integrated circuit packaging, and mainly relates to a packaging technology for enhancing chip heat dissipation, in particular to a heat dissipation cover plate and a chip. Background technique [0002] Chip packaging is to place the chip on a substrate that acts as a load bearing, lead out the pins, and then fix and package it as a whole through the packaging process. The packaging structure is not only used as a bridge between the inside and outside of the chip, but also plays a role in protecting the chip and conducting heat dissipation. [0003] 3DIC packaging technology has become the core technology of advanced packaging due to its fine-pitch and high-density advantages. However, due to the increase in packaging density, the logic functions of the chip also increase accordingly, resulting in an increase in the power consumption of the chip itself, causing the temperature of the chip to rise. When th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367H01L23/373
CPCH01L23/3675H01L23/3737
Inventor 王慧梅
Owner XI AN UNIIC SEMICON CO LTD
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