A semiconductor device heat dissipation structure and its preparation method

A heat dissipation structure and semiconductor technology, applied in semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve problems such as large thermal resistance and poor heat dissipation
CN112802811BActive Publication Date: 2021-06-25度亘核芯光电技术(苏州)有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
度亘核芯光电技术(苏州)有限公司
Publication Date
2021-06-25

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Abstract

A heat dissipation structure of a semiconductor device and a preparation method thereof. The heat dissipation structure of a semiconductor device includes a composite casing and a heat pipe arranged in the composite casing. Integral structure, the transition material layer is formed by mutual diffusion of atoms in the heat-absorbing material layer and the heat-dissipating material layer, a device mounting part is provided on the surface of the composite shell on the side of the heat-absorbing material layer, and the bottom surface of the device mounting part is used for setting In the semiconductor device, a cavity for circulating cooling medium is formed in the heat dissipation material layer, the composite shell and the tube wall of the heat pipe are integrally structured, and the heat pipe is located on the side opposite to the bottom surface of the device mounting part and extends toward the cavity. The heat dissipation structure of the semiconductor device is an integrated structure, there is no contact interface with high thermal resistance, and various heat dissipation methods can quickly dissipate the heat generated by the semiconductor device without increasing the volume of the heat dissipation structure of the semiconductor device, which can meet the needs of miniaturized devices.
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Description

technical field

[0001] The invention relates to the technical field of semiconductors, in particular to a heat dissipation structure of a semiconductor device and a preparation method thereof. Background technique

[0002] With the further development of science and technology, semiconductor technology, information technology and other cutting-edge technology fields are developing towards high power, high integration and miniaturization, resulting in the continuous increase of the heat dissipated by the system, and the high power density semiconductor devices inside the system continue to challenge the limit of its cooling system.

[0003] In the prior art, a simple air-cooled or liquid-cooled heat dissipation system is usually used to cool down semiconductor devices. The heat dissipation efficiency of this type of heat dissipation system is low, and the liquid-cooled heat dissipation system usually has multiple component structures. Different component structures There wil...

Claims

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