High-speed mini photoelectric conversion module design and process method

Abstract

The invention discloses a high-speed mini photoelectric conversion module design and process method. The process method comprises the following steps: S1, firstly employing an integrated design schemeof eight hard boards, four soft boards and six hard boards for a PCB part, successfully controlling the thickness of the soft boards to be within 0.35 mm through reducing the number of layers of thesoft boards in order to reduce the difficulty of a PCB plate making process, improve the rate of finished products of PCB plate making and improve the reliability of long-term bending of the soft plate part, and replacing the metal wall-filling plate by the design of the tungsten-copper heat sink and the ceramic gasket to make the process simple and the cost low; and S2, inputting 12 paths of differential electric signals to a 12-channel VCSEL drive through 12 paths of data ports of an optical module at a transmitting end, simultaneously modulating and driving the 12 paths of VCSEL to emit light through the 12-channel VCSEL drive, coupling the 12 paths of optical signals to an optimal state through a 12-channel lens array, and transmitting the 12 paths of optical signals to a far-end signal processor through an optical fiber, thereby realizing electro-optical conversion.

Description

technical field [0001] The invention relates to the technical field of aerospace measurement and control transmission system application and industrial automation control system, specifically a design and process method of a high-speed mini photoelectric conversion module. Background technique [0002] In recent years, the rise of network and business applications such as cloud computing, Internet of Things, and mobile Internet has put forward high bandwidth and bearer requirements for the underlying transport network, especially for network bandwidth, fast service provision, and network flexibility. have raised higher demands. A high-speed mini photoelectric conversion module. The photoelectric conversion module includes 12 channels of transmission and 12 channels of reception. The single channel rate is 10Gbps. The 12 channels of transmission and reception can work at the same time. The maximum transmission rate is 120Gbps. It is a mainstream optical module product in the ...

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Problems solved by technology

[0004] The purpose of the present invention is to provide a high-speed mini photoelectric conversion module design and process method to solve the traditional high-speed mini photoelectric conversion module proposed in the above background technology. The upper board of the PCB adopts a 10-layer hard board, and the lower board adopts a 6-layer soft board. The design of the design, the electrical connection between the upper board and the lower board is directly realized by the 6-layer soft board. When the shell is assembled, the 6-layer soft board needs to be bent. In order to meet the requirements of the shell assembly space, the thickness of the 6-layer soft board needs to be It is difficult to control the plate within 0.4mm. Generally, PCB board factories are unable to process, but they have the ability to process board factories. The price is expensive and the yield is not high, so the supply chain is greatly restricted. In addition, in order to achieve optical coupling needs In order to meet the mechanical strength and heat dissipation requirements, it is necessary to add a metal patching process to the 6-layer flexible board. The so-called metal patching process is to precisely adhere the pre-designed metal patching board to the PCB soft board through adhesive hot pressing. In this way, the mechanical strength of the PCB soft board can be increased, and at the same time, it can assist the heat equalization and heat dissipation of the heating device. This process is a precision process, and the general PCB board factory cannot complete it. The metal wall patch is composed of a substrate, a large boss, and a small boss. , the thickness of the substrate is 0.35mm, the thickness of the large boss is 0.35mm, and the thickness of the small boss is 0.15mm. Among them, the flatness of the substrate surface is not less than 0.1mm, the flatness of the large boss is not less than 0.05mm, and the flatness of the small boss is not less than 0.01mm, the parallelism of the substrate surface is not less than 0.05mm, the connection between the substrate, the large boss, and the small boss is cleaned around, and the chamfer is less than 0.1mm. The manufacturing process is difficult and exceeds the general machining accuracy, subject to the PCB plate making process Complicated, difficult processing of metal patching boards, high adhesion precision requirements, etc., this type of photoelectric conversion module is difficult to mass-produce and the yield is very low

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