Butterfly radiator and optical module group and optical module group single plate with butterfly radiator

Abstract

The invention provides a butterfly radiator and an optical module group and an optical module group single plate with a butterfly radiator, a middle bottom plate is arranged at the tail end of a front bottom plate of the radiator, the other end of the middle bottom plate is connected with a rear bottom plate, a plurality of cooling fins are arranged on the front bottom plate, the middle bottom plate and the rear bottom plate, the middle bottom plate is an isosceles triangle, an included angle beta formed between the two side edges on the same side of the front bottom plate and the rear bottom plate>= 2 alpha, wherein 0 degree< alpha< 90 degrees. The optical module group is provided with a base which is fixedly connected on the rear end of the optical module and a jump ring or tabletting which is arranged on the base, and a butterfly radiator is arranged on the base. The single plate is provided with a plurality of optical module groups with the same structure which complies the arranged angle alpha and abreast arranged on the circuit plate, the optical module groups are provided with the optical module arranged on a single plate panel, the base which is fixed the rear end of the optical module, the jump ring or the tabletting which is arranged the base, and the butterfly radiator which is provided with a bend is arranged on the base. The butterfly radiator and the optical module group and the optical module group single plate with a butterfly radiator have the advantages of being capable of improving level of integration and assembly of the optical module and further improving heat dissipation performance of a single optical module.

Description

technical field [0001] The invention relates to a heat dissipation structure. In particular, it relates to a butterfly radiator used in the communication field, an optical module group and a single board of the optical module group with the butterfly radiator. Background technique [0002] In the current field of communication technology, optical modules are widely used in communication equipment. The heat source or other devices in the optical module need to work at a certain temperature, and the ambient temperature of the optical module changes greatly. It is necessary to ensure that the operating temperature of the optical module is lower than the maximum withstand temperature, and that the optical module has a good temperature at high temperature. Heat dissipation performance: At present, due to the limitations of the existing optical module's own heat dissipation structure and the influence of the fiber output direction of the optical module, the integration level of t...

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Problems solved by technology

The heat source or other devices in the optical module need to work at a certain temperature, and the ambient temperature of the optical module changes greatly. It is necessary to ensure that the operating temperature of the optical module is lower than the maximum withstand temperature, and that the optical module has a good temperature at high temperature. Heat dissipation performance; at present, due to the limitations of the existing optical module's own heat dissipation structure and the influence of the fiber output direction of the optical module, the integration of the optical module on the single board is not high.

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