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A Dispensing Control Method for Rigid-flex Circuit Board

A rigid-flexible combination and control method technology, which is applied in the fields of printed circuit manufacturing, printed circuit, and printed circuit assembly of electrical components, can solve the problem of affecting the flexural performance of rigid-flexible circuit boards, uncontrollable glue flow, and affecting product appearance quality and other problems to achieve the effect of avoiding poor product assembly and use performance, excellent appearance quality, and straight and beautiful dispensing

Active Publication Date: 2017-10-20
HUIZHOU KING BROTHER CIRCUIT TECH +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, after processing according to this dispensing process, the surface of the flexible area is smooth after dispensing, and the glue used for dispensing has fluidity. After dispensing, due to the fluidity of the glue during placement and baking, It is very easy to have poor quality problems: the glue flow is irregular and uneven, which greatly affects the appearance quality of the product, and the glue flow after dispensing cannot be controlled. Excessive glue flow may also affect the assembly and use of rigid-flex circuit boards The bending performance in the process affects the final use effect of the product

Method used

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Examples

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Embodiment Construction

[0024] In order to enable those skilled in the art to better understand the technical solution of the present invention, the product of the present invention will be further described in detail below in conjunction with examples.

[0025] A rigid-flexible circuit board dispensing control method, comprising the following steps:

[0026] The first step is the design of the choke line. The distance a between the choke lines is adjusted according to the width b of the choke line of the rigid-flex circuit board. The sum of the thickness of the single-sided rigid board and the prepreg of the circuit board (ie: longitudinal plate thickness) d is set, and the thickness and thickness of the choke line and the number of choke lines are determined according to the hardness of the glue. In the design of the choke line, control a=b+(0.2-0.5mm), c / d=tan (40°-50°). Among the number of choke lines, there are 2 choke lines when the glue hardness is 1-45, 1 choke line when the glue hardness is...

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PUM

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Abstract

The invention discloses a flex-rigid circuit board dispensing control method, which comprises the following steps of design of flow resistance lines, manufacturing of the flow resistance lines, dispensing, standing forming and curing shaping. During the flow resistance line design and manufacturing process, a=b+(0.2-0.5mm) and c / d=tan(40 DEG-50 DEG) are controlled; when hardness of glue is 1 to 45, the number of the flow resistance lines is two, and spray marking is carried out for two times, when the hardness of glue is 46 to 75, the number of the flow resistance line is one, and spray marking is carried out for two times, and when the hardness of glue is 76 to 100, the number of the flow resistance line is one, and spray marking is carried out for once; and the flow resistance line has a width of 0.3 to 0.5mm and a thickness of 0.2 to 0.3mm. The flex-rigid circuit board dispensing control method has the advantages of stable performance, good appearance quality, strong operability and low cost.

Description

technical field [0001] The invention relates to the technical field of circuit board manufacturing and processing, in particular to a rigid-flexible circuit board dispensing control method. Background technique [0002] Some rigid-flex boards require glue dispensing in the rigid-flex joint area. Due to the viscosity of the glue in the actual processing process, the glue will flow and penetrate on the board surface after dispensing; resulting in large differences in shape after dispensing. The quality is unstable, and it is easy to affect the appearance and performance of the product in severe cases. The general dispensing process of rigid-flex circuit boards is as follows: firstly prepare glue and rigid-flex circuit boards respectively. The process of glue preparation includes glue mixing and glue filling. , The rigid-flex circuit board preparation includes board testing, visual inspection, and then the prepared glue and the prepared rigid-flex circuit board are processed by...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/36B05D1/26B05D3/04
CPCB05D1/26B05D3/02B05D3/0406H05K3/361H05K2203/0743
Inventor 林启恒林映生陈春唐宏华
Owner HUIZHOU KING BROTHER CIRCUIT TECH