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Three dimensional mold object manufacturing apparatus, method for manufacturing three dimensional mold object, and three dimensional mold object

A technology for three-dimensional modeling and manufacturing equipment, which is applied in the directions of manufacturing auxiliary equipment, processing and manufacturing, transportation and packaging, and can solve problems such as poor adhesive liquid ejection, long supply pipe, and flight deflection of droplets.

Inactive Publication Date: 2015-08-26
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] However, since the existing three-dimensional modeling object manufacturing apparatus is configured in such a way that the ejection unit that ejects the adhesive liquid moves and ejects the adhesive liquid to the powder layer, there is a problem that the supply pipe must be long, so that the supply pipe must be long. Tube disposal space and other issues
In addition, since the supply pipe becomes longer, there is also a problem of poor discharge of the adhesive liquid due to bending, clogging, etc. of the pipe.
In addition, there are also problems such as the flight deflection of the liquid droplets due to the movement of the discharge part.

Method used

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  • Three dimensional mold object manufacturing apparatus, method for manufacturing three dimensional mold object, and three dimensional mold object
  • Three dimensional mold object manufacturing apparatus, method for manufacturing three dimensional mold object, and three dimensional mold object
  • Three dimensional mold object manufacturing apparatus, method for manufacturing three dimensional mold object, and three dimensional mold object

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Embodiment Construction

[0029] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.

[0030] 1. The first embodiment of the three-dimensional modeling object manufacturing device

[0031] First, a first embodiment of the three-dimensional modeled object manufacturing apparatus of the present invention will be described.

[0032] figure 1 It is a plan view when the first embodiment of the three-dimensional modeled object manufacturing apparatus of the present invention is viewed from above, figure 2 for figure 1 A cross-sectional view of the shown three-dimensional object manufacturing apparatus viewed from the right in the figure.

[0033] The three-dimensional shaped object manufacturing apparatus 100 is an apparatus for manufacturing a three-dimensional shaped object by laminating unit layers 2 formed using a three-dimensional modeling composition containing a three-dimensional modeling powder.

[0034] Three-dimensional modeli...

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Abstract

A three dimensional mold object manufacturing apparatus (100) configured to manufacture a three dimensional mold object by layering layers which are formed using a three dimensional molding composition which includes a three dimensional molding powder, has a molding section (10) configured to mold the three dimensional mold object, a layer forming section (12) configured to form the layers formed by the three dimensional molding composition, on the molding section, and a discharging section (15) configured to discharge bonding liquid, which bonds the three dimensional molding composition, with regard to the layers, and the molding section (10) configured so as to move to a drawing region of the discharging section (15).

Description

technical field [0001] The invention relates to a manufacturing device for a three-dimensional shaped object, a method for manufacturing a three-dimensional shaped object and a three-dimensional shaped object. Background technique [0002] There is known a three-dimensional shaped object manufacturing apparatus that uses a binder liquid to agglomerate powder to shape a three-dimensional object (for example, see Patent Document 1). This manufacturing apparatus shapes a three-dimensional object by repeatedly performing the following operations. First, the powder is bonded to each other by spreading the powder thinly with a doctor blade to form a powder layer, and spraying a bonding liquid to a desired portion of the powder layer. As a result, only the parts of the powder layer from which the binding liquid has been sprayed are bonded together to form a thin plate-shaped member (hereinafter referred to as "unit layer"). Thereafter, a powder layer is further thinly formed on t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C67/00B33Y80/00
CPCB29C67/0081B33Y10/00B29K2105/251B33Y30/00B33Y40/00B29C67/0096B29C64/165Y10T428/31504B29C64/357B33Y40/10B33Y40/20
Inventor 后藤淳一
Owner SEIKO EPSON CORP