Vacuum attaching device and display mother board attaching method

Abstract

The invention provides a vacuum attaching device and display mother board attaching method, and belongs to the technical field of attaching processes of display panels. The vacuum attaching device comprises a control unit, a first bearing table, a second bearing table, a curing unit and a heating unit, the first bearing table is opposite to the second bearing table, the curing unit is arranged on the peripheral area of the first bearing table or the second bearing table, the first bearing table is used for bearing a first mother board, the second bearing table is used for bearing a second mother board, sealing gum is coated on the peripheral area of the first mother board or the second mother board, the curing unit is used for curing the sealing gum, the control unit is used for controlling the curing unit to work or not, and the heating unit is used for heating the sealing gum under control of the control unit. The vacuum attaching device can solve the problems that the first mother board and the second mother board cannot be firmly attached by an existing attaching device, consequently, the first mother board and the second mother board are misplaced in the carrying process, and the display mother boards are poor.

Description

Technical field [0001] The invention belongs to the technical field of display panel bonding technology, and specifically relates to a vacuum bonding device and a bonding method of a display motherboard. Background technique [0002] The display device includes a first substrate and a second substrate that are boxed to each other, wherein the first substrate and the second substrate are boxed together by using a vacuum laminator for bonding. [0003] The specific box matching process includes: [0004] Place the first mother board including a plurality of first substrates on the laminating machine; apply a circle of UV glue to the peripheral area of ​​the second mother board to be bonded to the first mother board (ultraviolet curing Glue), coating glass frit on the packaging area around each first substrate of the first mother board; at this time, vacuum the environment where the laminating machine is located to bond the first mother board and the second mother board , Bonding to f...

AI Technical Summary

Problems solved by technology

[0005] The inventor finds that there are at least the following problems in the prior art: due to the characteristics of the UV glue itself, the chemical reaction that occurs when it is irradiated by a UV lamp can only cure about 50% of the UV glue, and the bonding strength is relatively weak and can only be cured by heat. The curing process can reach the completion of curing. However, during the transfer process of the first and second motherboards after entering the thermal curing process, due to insufficient curing strength, substrate misalignment and glue opening are prone to occur, resulting in the original paste. The accuracy of the first motherboard and the second motherboard with good precision becomes poor, thus affecting the quality of the final product

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