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High temperature transponder tag and method of use

A technology of transmitters and transponders, applied in the field of high temperature resistant transponder labels, which can solve problems such as impossibility and difficult data exchange

Active Publication Date: 2018-11-09
SCHREINER GRP GMBH & CO KG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Especially when transponders are laid on metal surfaces, data exchange can become difficult or even impossible

Method used

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  • High temperature transponder tag and method of use
  • High temperature transponder tag and method of use
  • High temperature transponder tag and method of use

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0044] figure 1 A first embodiment of a high temperature resistant transponder label 1 suitable for sticking to a conductive substrate is shown. Due to the heat resistance of the materials used for the individual layers of the transponder label, the transponder label is particularly suitable for use at temperatures between 125°C and 400°C, e.g. The temperature that occurs during the drying process of a lacquer on a conductive substrate.

[0045] The heat-resistant transponder tag 1 comprises a transponder 10 with a chip 11 and an antenna structure 12 connected to the chip. In addition, the transponder label 1 has an adhesive material layer 20 for sticking the transponder label 1 on a conductive substrate and for isolating the transponder device from the conductive substrate and arranging the transponder device thereon. Spacer layer 30 of transponder 10 . The spacer layer 30 has an underside U30 on which the layer of adhesive material 20 is arranged. Furthermore, the transp...

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PUM

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Abstract

A high temperature resistant transponder label (1) comprises a transponder device (10), an adhesive material layer (20) for sticking the transponder label (1) on a conductive substrate (3) and an arrangement thereon Spacer layer (30) of the transponder (10) for separating it from the conductive substrate (3). The adhesive material layer (20) and the spacer layer (30) each have such a temperature-resistant material that after the transponder label (1) is pasted on the conductive substrate (3), from an initial temperature below 125° C. When heated to a higher temperature between 125°C and 400°C and cooled to the initial temperature after heating, the transponder label (1) covers the The size of the face (A) remains constant.

Description

technical field [0001] The present invention relates to a high temperature resistant transponder label suitable for placement on a conductive substrate to be painted. In addition, the invention also relates to a method for marking a conductive substrate to be painted with a transponder label. Background technique [0002] In order to control the production process, it is becoming more and more important to mark the products processed within the scope of the production process. Since the control of the production process and the conveying of the products during the production process are carried out more and more semi-automatically or fully automatically, it is necessary for the individual products to be automatically inspected within the production line. For this purpose, for example, transponder labels applied to the products to be processed can be used. Such transponder tags have a chip on which information characterizing the product or production process can be stored. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06K19/077G09F3/02
CPCG06K19/02G06K19/07771B32B2307/306B32B2519/02B32B37/12B32B37/24B32B38/10B32B2037/243B32B2519/00G06K19/07722G06K19/0776
Inventor G·赫尔兹尔J·贝克
Owner SCHREINER GRP GMBH & CO KG
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