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A film box device capable of identifying the presence or absence of silicon wafers

A chip box and silicon chip technology, which is applied in the manufacture of electrical components, semiconductor/solid-state devices, circuits, etc., can solve the problems of large area occupied by the device and cumbersome operation, and achieve the advantages of small occupied space, accurate measurement, and easy promotion Effect

Active Publication Date: 2018-01-26
SHANGHAI INTEGRATED CIRCUIT RES & DEV CENT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] However, the above-mentioned device occupies a large area, and before each slice is taken, the manipulator needs to scan the silicon wafer up and down, and the operation is cumbersome. It can be seen that those skilled in the art urgently need to provide a fast and accurate identification. Cassette device without silicon wafers, simplifying the operation steps

Method used

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  • A film box device capable of identifying the presence or absence of silicon wafers
  • A film box device capable of identifying the presence or absence of silicon wafers
  • A film box device capable of identifying the presence or absence of silicon wafers

Examples

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Embodiment Construction

[0028] In order to make the content of the present invention clearer and easier to understand, the content of the present invention will be further described below in conjunction with the accompanying drawings. Of course, the present invention is not limited to this specific embodiment, and general replacements known to those skilled in the art are also covered within the protection scope of the present invention. Secondly, the present invention is described in detail by means of schematic diagrams. When describing the examples of the present invention in detail, for the convenience of explanation, the schematic diagrams are not partially enlarged according to the general scale, which should not be used as a limitation of the present invention.

[0029] It should be noted that, in the following examples, using Figure 2-4 The schematic diagram of the structure describes in detail the cassette device that can identify the presence or absence of silicon wafers according to the p...

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Abstract

The invention relates to the technical field of semiconductor manufacturing equipment, and provides a sheet box device capable of identifying the existence of silicon wafers. The sheet box device comprises a sheet box body, wherein the sheet box body is used for storing a plurality of silicon wafers. The sheet box device also comprises at least one pair of elastic pressing sheets, a plurality of pressure sensitive sensors and an RFID electronic tag, wherein the elastic pressing sheets are matched with each other and are used for restricting the positions of the silicon wafers; the pressure sensitive sensors are arranged on the rear elastic pressing sheet, the positions of the pressure sensitive sensors and the positions of the silicon wafers are distributed in a one-to-one correspondence manner, and each pressure sensitive sensor is used for sensing the pressure value of the corresponding silicon wafer; and the RFID electronic tag is arranged on the outer side wall of the sheet box body, and is used for recording the serial number of the sheet box body and the pressure values of the silicon wafers. The sheet box device can quickly and accurately determine the existence of the silicon wafers in slots, and information recorded in the RFID electronic tag can be directly read before the silicon wafers are taken and placed, so that the operation is convenient and quick.

Description

technical field [0001] The invention relates to the technical field of semiconductor process equipment, in particular to a chip box device which can identify whether there is a silicon chip or not. Background technique [0002] With the development of semiconductor integrated circuit manufacturing technology, silicon wafers have grown from 200mm to 300mm or larger. Silicon wafer storage devices play a very important role in semiconductor manufacturing processes. Semiconductor silicon wafers require special processing due to their characteristics in the production process. Usually, chip manufacturing companies usually use Front Opening Unified Pod (FOUP) to store silicon wafers, referred to as the pod. [0003] In the prior art, before processing the silicon wafers, a manipulator is usually used to pick up the silicon wafers in the cassette, and after the process is completed, the silicon wafers are transported to the cassette by the manipulator for storage. With the develop...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/673H01L21/66H01L21/687
CPCH01L21/673H01L21/6735H01L21/67383H01L21/68714H01L22/20H05K13/0084
Inventor 任大清
Owner SHANGHAI INTEGRATED CIRCUIT RES & DEV CENT