Integrated heat-pipe heat dissipating device

Abstract

An integrated heat-pipe heat dissipating device comprises a plurality of the heat dissipating pipes, a heat conducting seat and a plurality of heat dissipating fins, wherein the heat dissipating fins are fixedly assembled on one surface of the heat conducting seat separately, and propped against and perpendicularly connected to the heat conducting seat; the heated sections of the heat dissipating pipes are matched with the other surface of the heat conducting seat in a gapless manner; the heat dissipating sections of the heat dissipating pipes are assembled in the heat dissipating fins; two sub pipes adopting the same structure are separately arranged on each heat dissipating pipe; a plurality of circular through holes are formed in the heat dissipating fins, and a plurality of scrape-proof baffles are arranged on the heat dissipating fins. The integrated heat-pipe heat dissipating device has the characteristics of being good in heat dissipating effect.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of electronic products, in particular to an integrated heat pipe heat dissipation device. Background technique [0002] Good heat dissipation performance is an important guarantee to ensure the effective operation of electronic products. Electronic products usually use heat sinks made of aluminum or copper for heat dissipation, and some larger products are also cooled by liquids such as water or other cooling fluids. However, with the gradual miniaturization of electronic products, the volume of the cooling device is required to be smaller and smaller, and the traditional cooling device can no longer meet the requirements. [0003] In the prior art, for the heat dissipation problem of electronic products such as CPU, LED, etc., heat dissipation is also carried out through heat sinks, but this method still has the defect of limited heat dissipation effect. [0004] Therefore, in view of t...

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Problems solved by technology

However, with the gradual miniaturization of electronic products, the size of the cooling device is required to be smaller and smaller, and the traditional cooling device can no longer meet the requirements.

[0003] In the prior art, for the heat dissipation problem of electronic products such as CPU, LED, etc., heat dissipation is also carried out through heat sinks, but this method still has the defect of limited heat dissipation effect

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