Die supply device

A technology for supplying devices and bare chips, which is applied in the manufacture of electrical components, semiconductor/solid-state devices, circuits, etc., can solve the problem of adsorption of qualified bare chips, and achieve the effect of simplifying calculation and processing

Active Publication Date: 2015-08-26
FUJI KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, the acceptable die 31 may not be picked up in the correct order, or the bad die A or the area without a die may be mistakenly estimated as the next pick-up die and photographed, causing problems.

Method used

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Embodiment Construction

[0023] Hereinafter, an example which actualizes the embodiment for carrying out the present invention will be described.

[0024] First, use figure 1 , the structure of the die supply device 11 is schematically described.

[0025] The die supply device 11 is provided with a magazine holding unit 22 (tray tower), a tray pull-out table 23, an XY moving mechanism 25, and a jacking unit 28 (refer to figure 2 ), etc., and set the tray pull-out table 23 in a state inserted into a component mounting machine (not shown).

[0026] In the magazine (not shown) accommodated in the magazine holding part 22 of the die supply device 11 in a manner capable of moving up and down, the wafer tray 32 on which the wafer spreader 30 is mounted is loaded in multiple layers, and the wafer tray 32 is loaded in multiple layers during production. The magazine pulls the wafer tray 32 out onto the tray pullout station 23 . Such as image 3As shown, the wafer stretching body 30 is installed on a cutt...

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PUM

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Abstract

In an array of dies (31) on a dicing sheet (34), a plurality of reference dies (45) images of which are recognizable are arranged at predetermined distances. In the case where a distance from a position of a die (31(a)) adsorbed this time to a position of a die (31(b)) to be adsorbed next that is estimated according to the position of the die (31(a)) adsorbed this time is equal to or greater than a predetermined value, the position of the die (31(b)) to be adsorbed next is recognized, and in addition to this, a reference die (45) close to the die (31(b)) to be adsorbed next is selected from a plurality of reference dies (45) and an image of the selected reference die (45) is picked up by a camera (42) so that the position of the reference die (45) is recognized. Based on the position relationship between the recognized position of the reference die (45) and the recognized position of the die (31(b)) to be adsorbed next, whether or not the recognized position of the die (31(b)) to be adsorbed next is a position of a correct die (31(c)) to be adsorbed next is determined. If it is determined that the recognized position of the die (31(b)) to be adsorbed next is not the position of the correct die (31(c))to be adsorbed next, the position of the die (31(c)) to be adsorbed next is re-estimated with reference to the recognized position of the reference die (45), an image of the die (31(c)) is picked up by the camera (42) so that the position of the die (31(c)) is recognized, and a pushing-up operation and an adsorption operation are executed.

Description

technical field [0001] The present invention relates to a die supply device for supplying bare chips from a wafer spreader in which stretchable dicing sheets to which wafers to be diced are pasted are stretched. Background technique [0002] In recent years, as described in Patent Document 1 (Japanese Unexamined Patent Publication No. 2010-129949 ), a die supply device for supplying die is provided on a component mounting machine, and the die is mounted on a circuit board by the component mounting machine. This die supply device includes: a wafer tray formed by stretching a stretchable dicing sheet on a dicing frame to which a wafer to be diced to be divided into a plurality of dies is pasted; and a top disposed below the dicing sheet. Lifting pin, when the suction nozzle is lowered to absorb and pick up the die on the above-mentioned cutting sheet, the sticking part of the die to be adsorbed in the cutting sheet is lifted by the lifting pin, so that the sticking part of the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K13/02H01L21/68
CPCH01L21/681H05K13/043H01L21/67132H01L21/67259
Inventor 柘植邦明贵岛达也山下义哲
Owner FUJI KK
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