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A kind of ito conductive film

A technology of conductive film and conductive adhesion layer, applied in the field of ITO conductive film, can solve the problems of easy disconnection and poor bending effect, and achieve the effect of increasing weather resistance, overcoming poor adhesion effect, and solving adhesion and anti-oxidation problems.

Active Publication Date: 2016-12-28
SHANTOU WANSHUN NEW MATERIAL GROUP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention aims at the deficiencies of the prior art, and provides an ITO conductive film, the thickness of the ITO conductive film is hundreds of nanometers to achieve the required conductive effect, and avoiding the use of adhesives, which can effectively solve the problem of ITO conductive film bending The problem of poor effect and easy disconnection

Method used

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  • A kind of ito conductive film
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  • A kind of ito conductive film

Examples

Experimental program
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Effect test

Embodiment 1

[0034] Embodiment 1: In the production of this embodiment 1, the substrate 1 is first treated with plasma cleaning, and then the optical adjustment layer 2, the ITO layer 3, and the conductive layer can be sequentially plated on the surface by sputtering or evaporation. The adhesion layer 4 and the copper wire layer 5, wherein the conductive adhesion layer 4 has a thickness of 1 nm.

Embodiment 2

[0035] Embodiment 2: The preparation process and structure of Embodiment 2 are the same as those of Embodiment 1, except that the thickness of the conductive adhesive layer 4 is 2 nm.

Embodiment 3

[0036] Example 3: The preparation process and structure of Example 3 are the same as Example 1, except that the thickness of the conductive adhesive layer 4 is 10 nm.

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Abstract

The invention provides a novel ITO conductive film comprising a base material layer, and an optical adjustment layer, an ITO layer, a conductive adhesion layer, a copper conductor layer, and a conductive blocking layer, all of which are stacked on the upper surface of the base material layer. The thickness of the conductive adhesion layer is 1-100 nm. The thickness of the copper conductor layer is 50-800nm. The conductive blocking layer has a conductive function, and the thickness of the conductive blocking layer is 1-100nm. The surface resistance of the ITO layer is 80-400omega / square, and the change rate of the surface resistance is 0-20% after the ITO layer soaks in 1N hydrochloric acid for 3 minutes. According to the ITO conductive film provided by the invention, the copper conductor layer is directly made on the ITO layer, no adhesive is needed, and the problem of coiling is solved. Moreover, the conductive adhesion layer is added between the ITO layer and the copper conductor layer, and the conductive blocking layer is added on the copper conductor layer, so that the problem that the adhesion effect of copper and ITO is not good and oxidation can be easily caused is overcome effectively, the problems of adhesion and anti-oxidation can be solved, and the weather resistance of products is increased.

Description

Technical field [0001] The invention relates to a transparent conductive film, in particular to an ITO conductive film coated with copper on the surface. Background technique [0002] At present, more and more electronic devices such as mobile phones and tablet computers use touch screens. Touch screens are very popular and common as an input device. Therefore, the demand for transparent conductive films that are essential for touch screens is increasing. . Among them, resistive and capacitive touch screens are more commonly used. With the advancement of technology, various structures of capacitive touch screens continue to emerge. The most commonly used ones are Apple’s classic double-sided ITO structure, single-sided TP bridge structure, film-glass structure, film-film-glass structure, etc. In the capacitive screen structure of film-film structure, most of the electrode leads are made of silk-screened silver paste. After the induction pattern is made by the ITO conductive fil...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B5/14H01B1/02
Inventor 胡文玮杜成城刘比尔
Owner SHANTOU WANSHUN NEW MATERIAL GROUP CO LTD
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