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A kind of production technology of intelligent electronic label

A technology of smart electronic tags and production technology, which is applied in the direction of recording carriers, instruments, and computer parts used by machines, can solve the problems of high cost, poor reliability, and unfavorable promotion and application, and achieve high contact reliability and long service life. Long, Inexpensive Effects

Active Publication Date: 2018-04-03
SHENZHEN KEXIN COMM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Moreover, there are many manufacturers and widely used. It is a mature memory chip, but the problem is that the memory chip needs at least 4 contact pins, and its reliability is worse than the single-bus Maxim memory chip that only needs 2 contact pins. The electronic chips produced by memory chips are complex in process and high in cost, which is not conducive to popularization and application

Method used

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  • A kind of production technology of intelligent electronic label
  • A kind of production technology of intelligent electronic label
  • A kind of production technology of intelligent electronic label

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Such as figure 1 As shown, a smart electronic label of the present invention includes a circuit board 11 , a memory chip 12 and an audio connector 13 . The circuit board 11 is a miniature multi-layer PCB board, and the size of the PCB board is slightly larger than that of the memory chip 12. The front side of the circuit board 11 is provided with 8 pads and 3 welding holes corresponding to the memory chip. There is also a rectangular pad at the same time. The memory chip 12 of the present invention adopts an EEPROM memory chip with 4 pads I2C protocol customized by the manufacturer, and the packaging form of the memory chip can be any chip in DFN8, TSSOP8, or SOT23-5.

[0037] Such as figure 1 As shown, the audio connector 13 adopts a custom-made 4-section 2.5mm audio connector, and the welding part at the tail of the audio connector does not leave plastic for the limit. Second, third and fourth quarters. The technical specifications of the audio connector 13 shall ...

Embodiment 2

[0053] The difference between the second embodiment and the first embodiment lies in the structures of the circuit board 11 and the audio connector 13 . In this embodiment, the circuit board 11 does not adopt the structure of welding holes, but is provided with 4 pads on the circuit board 11, and the audio connector 13 adopts an ordinary 4-section 2.5mm audio connector, and the welding part is a cylinder body, which are respectively the first, second, third and fourth sections from thin to thick. The circuit board 11 and the audio connector 13 are connected by welding with three wires 111, that is, the A, L, and D pads are respectively welded to the second, third and fourth sections of the welding part of the audio connector 13 through the wires. . A welding pad on the outermost edge of the circuit board 11 is welded to the first joint of the welding part of the audio connector 13 .

[0054] The production process of the smart electronic label of the present embodiment compr...

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Abstract

A production process for an intelligent electronic label comprises the following steps: 1) manufacturing metal sleeves with weld legs, respectively sleeving the metal sleeves on the welding parts of an audio connector, and compressing through a machine, 2) printing solder paste on a whole circuit board through a steel net, 3) plastering a storage chip on the circuit board on which the solder paste is printed, 4) welding the circuit board on which the storage chip is plastered through a reflow process, 5) inserting the weld lugs of the audio connector into the welding holes of the circuit board, and 6) processing the circuit board with the storage chip and the audio connector by an automatic tin welding machine, thereby finishing manufacture of the intelligent electronic label. The intelligent electronic label which is produced through the production process has advantages of low price, high contact reliability and long service life.

Description

【Technical field】 [0001] The invention relates to the field of electronic labels, in particular to a production process of an intelligent electronic label. 【Background technique】 [0002] In recent years, the smart ODN industry has continued to develop under the joint promotion of the National Standardization Association and the three major operators, and the relevant standards of the industry have also been continuously matured and improved. However, the current technical solutions adopted by smart ODN products mainly include Maxim's single-bus memory chip and RFID memory chip. The cost of the single-bus solution is more than 3.5 yuan because of the exclusive patent memory chip, which is relatively high, and it is difficult to reduce the cost in the long run. The cost of the reader / writer of the RFID storage chip technical solution is also relatively high, and the reliability is poor. As a result, it is difficult to promote the entire smart ODN industry, and the industry ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06K19/077
Inventor 欧阳星涛温汝坪沈美胜
Owner SHENZHEN KEXIN COMM TECH