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A stepped groove circuit board and its processing method

A processing method and step groove technology, applied in printed circuit, multi-layer circuit manufacturing, printed circuit manufacturing, etc., to achieve the effect of avoiding pollution and avoiding hole plugging

Active Publication Date: 2018-06-26
SHENNAN CIRCUITS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The embodiment of the present invention provides a stepped groove circuit board and its processing method to solve the above-mentioned various problems existing in the prior art when manufacturing a stepped groove circuit board with metallized through holes in the stepped groove area.

Method used

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  • A stepped groove circuit board and its processing method
  • A stepped groove circuit board and its processing method
  • A stepped groove circuit board and its processing method

Examples

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Embodiment 1

[0021] Please refer to figure 1 , an embodiment of the present invention provides a method for processing a stepped groove circuit board, which may include:

[0022] 110. Install a gasket on the first surface of the first laminate and laminate the second laminate, and arrange an isolation protection film on the second surface of the first laminate and laminate the third laminate, and perform pressing, wherein, The first laminate has a metallized through hole located in the stepped groove area, and the gasket is located in the stepped groove area.

[0023] Said first laminate includes layers that are not stepped groove levels. Assume that a multilayer circuit board with (P+Q) layers needs to be made in the end, where P and Q are both positive integers greater than or equal to 1; and step grooves need to be processed on the multilayer circuit board, assuming step grooves Located on the (P+1)th floor to (P+Q)th floor. Then, the first laminate includes the 1st layer to the Pth ...

Embodiment 2

[0039] Please refer to Figure 2d , the embodiment of the present invention provides a stepped groove circuit board 50, the first surface of the stepped groove circuit board 50 has a stepped groove 52, and the bottom surface of the stepped groove 52 has a metallization that penetrates to the second surface of the stepped groove circuit board Through hole 21.

[0040] In some embodiments of the present invention, the bottom surface of the stepped groove 52 has a surface mount pattern 53, the surface mount pattern 53 can pass through the metallized through hole 21, and the circuit pattern 54 or other patterns on the second surface of the stepped groove Inner line graphic connection. The metallized through hole 21 can also be used as an insertion hole, and the pins of the electronic components in the step groove can be inserted into the metallized through hole 21 . Alternatively, the metallized through hole 21 can also be used as a heat dissipation hole to dissipate heat for th...

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PUM

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Abstract

The invention discloses a stepped groove circuit board and a processing method for the same in order to solve many technical problems in the prior art of manufacturing a stepped groove circuit board, wherein the stepped groove region of the stepped groove circuit board is provided with a metallized through hole . In some feasible embodiment, the processing method steps of arranging a pad on a first surface of a first plywood and laminating a second plywood, arranging an isolation protective film on a second surface of the first plywood and laminating a third plywood and performing lamination. wherein the first plywood has the metallized through hole positioned in the stepped groove region and the pad is arranged in the stepped groove region, making a groove on one side of the second layer plywood in the stepped groove region, wherein the depth of the groove reaches the pad, removing the pad to form the stepped groove, and removing the third layer plywood and the isolation protective film to make a stepped groove circuit board,wherein the bottom of the stepped groove has the metallized through hole.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a stepped groove circuit board and a processing method thereof. Background technique [0002] At present, there are more and more applications of step groove circuit boards. There is such a special design, that is, there is a metallized through hole under the step groove, which is used as a plug hole or a conduction hole or a heat dissipation hole, and the metallization Vias are not allowed to be plugged. [0003] The manufacturing method of the step groove circuit board with metallized through holes designed in the step groove area includes the following steps: non-step level lamination, drilling at the position of the step groove, sinking copper electroplating, attaching gaskets, step level lamination, Immersion copper electroplating, outer layer graphic production, step slotting, desmearing, surface production, etc. [0004] But there is following defect in above-ment...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/42H05K3/46H05K1/11
Inventor 丁大舟刘宝林缪桦
Owner SHENNAN CIRCUITS