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Manufacturing method of semiconductor device and semiconductor device

A manufacturing method and semiconductor technology, applied in the direction of semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as short circuit and thick film

Inactive Publication Date: 2015-09-16
KK TOSHIBA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Burrs are generated when the object to be cut is cut, and may cause thickening of the package or short circuit.

Method used

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  • Manufacturing method of semiconductor device and semiconductor device
  • Manufacturing method of semiconductor device and semiconductor device
  • Manufacturing method of semiconductor device and semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0022] figure 1 It is a flowchart showing an example of a method of manufacturing a semiconductor device. figure 1 The illustrated semiconductor device manufacturing method example includes at least a preparation step (S1-1), a mounting step (S1-2), a sealing step (S1-3), a terminal forming step (S1-4), a first cutting step ( S1-5), the second cut-in step (S1-6). In addition, the content of steps and the order of steps in the example of the method of manufacturing a semiconductor device in this embodiment are not necessarily limited to figure 1 steps shown.

[0023] The preparation step (S1-1) is a step of preparing a laminate including a metal plate and a semiconductor chip provided on a part of the metal plate. The laminate has, for example, a TSV-type laminate structure, and is formed, for example, by laminating a plurality of semiconductor chips on a metal plate and electrically connecting the semiconductor chips with through-electrodes penetrating the semiconductor ...

no. 2 approach

[0064] In this embodiment mode, a method for manufacturing a semiconductor device in a different order of steps from that in the first embodiment will be described.

[0065] Figure 9 It is a flowchart showing an example of a method of manufacturing a semiconductor device. Figure 9 The example of the method for manufacturing a semiconductor device includes at least a preparation step (S2-1), a mounting step (S2-2), a sealing step (S2-3), a first cutting step (S2-4), and a terminal forming step ( S2-5), and the second cut-in step (S2-6). In addition, the preparation step (S2-1) corresponds to figure 1 The preparation step (S1-1), the loading step (S2-2) corresponds to figure 1 The loading step (S1-2), the sealing step (S2-3) corresponds to figure 1 The sealing step (S1-3). Therefore, regarding the preparation step ( S2 - 1 ) to the sealing step ( S2 - 3 ), the description of the manufacturing method of the semiconductor device according to the first embodiment can be a...

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PUM

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Abstract

A semiconductor device manufacturing method includes mounting a stacked body on a first surface of a wiring substrate, the stacked body including a metal plate and semiconductor chips that are stacked on a part of the metal plate and located on the first surface side of the wiring substrate, forming a resin layer to seal the stacked body on the first surface of the wiring substrate, forming a first cut reaching the sealing resin layer by using a first dicing blade while cutting either the metal plate or the wiring substrate, the first cut surrounding the stacked body, and forming a second cut reaching the first cut using a second dicing blade while cutting the other of the metal plate and the wiring substrate to separate the wiring substrate in correspondence with the location of the stacked body, the second cut also surrounding the stacked body.

Description

[0001] Connected application [0002] This application enjoys the priority of the basic application based on Japanese Patent Application No. 2014-52715 (filing date: March 14, 2014). This application incorporates the entire content of the basic application by referring to this basic application. technical field [0003] Embodiments of the present invention relate to a method of manufacturing a semiconductor device and the semiconductor device. Background technique [0004] In recent years, with the development of communication technology and information processing technology, there has been an increasing demand for downsizing and speeding up semiconductor devices. In response to this demand, among semiconductor devices, the development of a semiconductor package is being promoted for the purpose of shortening the length of the wiring between parts and corresponding to the operating frequency by using three-dimensional packaging in which a plurality of semiconductor chips a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/8247H01L21/56H01L27/115H01L23/31H10B69/00
CPCH01L24/17H01L2225/06541H01L2924/186H01L21/78H01L23/04H01L23/49838H01L2924/37H01L24/96H01L2224/116H01L2924/0665H01L2224/11849H01L25/0657H01L25/50H01L23/3107H01L2224/81345H01L2225/06517H01L24/81H01L23/481H01L24/11H01L23/295H01L2924/1438H01L21/563H01L21/4878H01L2924/181H01L23/3128H01L23/3135H01L21/561H01L2224/02372H01L2224/13111H01L2224/16146H01L2224/16227H01L2224/1703H01L2224/17181H01L2224/2919H01L2224/32245H01L2224/81191H01L2224/81815H01L2224/81986H01L23/36H01L23/49816H01L2225/06527H01L25/18H01L2225/06575H01L2225/06589H01L2225/06513H01L2924/00014H01L2924/01047H01L2924/01029H01L2924/00012
Inventor 川户雅敏
Owner KK TOSHIBA