Unlock instant, AI-driven research and patent intelligence for your innovation.

Multi-specification photolithography plate cleaning fixture

A technology for cleaning jigs and photolithography plates, which is applied in the manufacture of electrical components, semiconductor/solid-state devices, circuits, etc., can solve the problems of low cleaning efficiency and high equipment cost, and achieve the goals of reducing procurement costs, improving safety, and preventing shedding Effect

Active Publication Date: 2018-01-19
宁波安芯美半导体有限公司
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the current cleaning process of photoresist plates, for different specifications of photoresist plates, only cleaning fixtures of corresponding specifications can be used for cleaning, the cleaning efficiency is low, and the equipment cost is high

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Multi-specification photolithography plate cleaning fixture
  • Multi-specification photolithography plate cleaning fixture
  • Multi-specification photolithography plate cleaning fixture

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Taking cleaning a 6-inch photolithography plate as an example, the support cylinder 14 is installed in the bottom bracket through hole 11 of the bottom bracket 12, and the two ends are fixed together with the two main bracket plates 4 through the bottom plate fixing screw holes 5 respectively, and the bottom bracket Installed at the lower and outer positions of the two main brackets 4; the bottom cylinder 6 is fixed below the hole 1 on the main bracket 4; first, a side bracket 9 is fixed to the side bracket fixing screw hole 3 corresponding to the 6-inch photolithography plate by bolts , so that the opening of the side bracket slot is inward, fix the optical 6-inch engraving plate to the bottom bracket slot 13 and the corresponding side bracket slot 7 one by one, and then install the other side bracket 9 to the corresponding 6-inch photo-engraving plate The side bracket is fixed on the screw hole 3, and the side bracket slot 7 is engaged with each photolithography plate....

Embodiment 2

[0037] Taking the cleaning of a 2-inch photolithography plate as an example, the support cylinder 14 is installed in the bottom bracket through hole 11 of the bottom bracket 12, and the two ends are fixed together with the two main bracket plates 4 through the bottom plate fixing screw holes 5 respectively, and the bottom bracket Installed at the lower and outer positions of the two main brackets 4; fix the three bottom cylinders 6 below the hole 1 on the main bracket 4; first fix a side bracket 9 to the side bracket corresponding to the 2-inch photolithography plate by bolts On the screw hole 3, make the opening of the side bracket slot inward, fix the light 2-inch engraving plate to the bottom bracket slot 13 and the corresponding side bracket slot 7 one by one, and then install the other side bracket 9 to the 2-inch light The side bracket corresponding to the engraving plate is fixed on the screw hole 3, and the side bracket slot 7 is engaged with each photolithography plate...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a multi-specification photoetching model cleaning tool, relating to the semiconductor manufacture technical field, and mainly comprises main supports (4), side supports (9), a bottom support (12), a support cylinder (14) and a bottom cylinder (6), wherein the support cylinder (14) and the main supports (4) are in connection through bolts; the side supports (9) and the main supports (4) are in connection through bolts; the bottom support (12) is in connection with the main supports (4) through bolts; the bottom cylinder (6) is fixed to the lower parts of the main supports (4). The multi-specification photoetching model cleaning tool can be used for cleaning photoetching models of different specifications, and can clean a plurality of photoetching models of a same specification once, thereby effectively increasing the cleaning efficiency of a photoetching model, and reducing equipment purchase cost.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a multi-standard photolithography plate cleaning jig. Background technique [0002] In the manufacturing process of semiconductor chips, special die patterns can only be produced after the chip is coated with photoresist and processed by special photolithography. Since the chip must use a photolithography plate during exposure, and the gap between the chip and the photolithography plate during exposure It is very small, and there are defects on the surface of a small number of chips. After the surface of the chip is coated with photoresist, the surface is uneven, so the photoresist plate and the chip will contact each other during exposure. As a result, there is residual glue in some areas on the photoresist plate and cannot be used any more. Since the photoresist plate is expensive and can be reused, the contaminated photoresist plate needs to be cleaned with...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCH01L21/67023
Inventor 丁维才冯靖
Owner 宁波安芯美半导体有限公司