Flexible device and its preparation method
A technology of flexible devices and anode active materials, applied in the field of flexible devices and their preparation, can solve problems such as great difficulty, decreased bonding strength, and easy fatigue, so as to improve interface problems, increase bonding strength, and increase contact area Effect
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Embodiment 1
[0034] Preparation of porous current collector: select copper foil with a thickness of 100 μm as the positive electrode current collector, and then use laser drilling to sinter the current collector to obtain a circular hole shape, a hole diameter of 2 μm, and a hole spacing (two holes at most The distance between the adjacent edges) is 1 μm and the hole depth is 99 μm, so as to obtain a porous current collector for use;
[0035] Negative sheet preparation: use silicon-carbon composite (30% silicon content) as the negative electrode active material, PVDF as the binder, Supper-P as the conductive agent (the mass ratio of the three is 94:3:3), and NMP as the solvent configuration Slurry; then coated on the surface of the above-mentioned porous current collector containing the pore structure (control the coating thickness during coating so that W1 / (W1+W2)=50%), dry, cold press, cut into single The sheet (with an empty foil area around it and a coated area in the middle) is ready ...
Embodiment 2
[0038] The difference from Example 1 is that it includes the following steps:
[0039] Preparation of the porous current collector: the pore depth of the porous current collector is 90 μm.
[0040] The rest are the same as in Embodiment 1 and will not be repeated here.
Embodiment 3
[0042] The difference from Example 1 is that it includes the following steps:
[0043] Preparation of porous current collector: select copper foil with a thickness of 100 μm as the negative electrode current collector, and then use laser drilling to sinter the current collector to obtain a circular hole shape, a hole diameter of 1 μm, and a hole spacing (two holes at the maximum The distance between the adjacent edges) is 4.17 μm and the hole depth is 85 μm, so as to obtain a porous current collector for use;
[0044] Negative sheet preparation: use silicon-carbon composite (30% silicon content) as the negative electrode active material, PVDF as the binder, Supper-P as the conductive agent (the mass ratio of the three is 94:3:3), and NMP as the solvent configuration Slurry; then coated on the surface of the above-mentioned porous current collector containing the pore structure (control the coating thickness during coating so that W1 / (W1+W2)=10%), dry, cold press, cut into sing...
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