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Photosensitive resin composition and method for forming pattern using same

A technology of photosensitive resin and composition, which is applied in the field of photosensitive resin composition, can solve the problems of resolution, adhesion and residual film rate, etc., and achieve the effect of excellent characteristics and preventing greening

Active Publication Date: 2020-01-14
DONGJIN SEMICHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] This kind of photoresist can be used to form an insulating film, columnar spacer, overcoat or color filter layer, but the composition structure of the photosensitive resin composition used to form the photoresist has great influence on the resolution, adhesion and residual film rate. wait will have an impact

Method used

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  • Photosensitive resin composition and method for forming pattern using same
  • Photosensitive resin composition and method for forming pattern using same
  • Photosensitive resin composition and method for forming pattern using same

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0082] Synthesis example 1 (preparation of acrylic copolymer)

[0083] A mixed solution of 400 parts by weight of tetrahydrofuran, 30 parts by weight of methacrylic acid, 30 parts by weight of styrene, and 40 parts by weight of glycidyl methacrylate was put into a flask equipped with a cooler and a stirrer. After the liquid composition was sufficiently mixed in a mixing vessel at a speed of 600 rpm, 15 parts by weight of 2,2'-azobis(2,4-dimethylvaleronitrile) was added. The temperature of the mixed solution of the polymerization is slowly raised to 55° C., and the temperature is maintained for 24 hours, then cooled to normal temperature, and then 500 ppm of hydrogen benzophenone (hydrobenzophenone) is added as a polymerization inhibitor to obtain a solid content of 30% by weight. of polymers.

[0084] In order to remove unreacted monomers in the polymer solution, 100 parts by weight of the polymer solution were precipitated with respect to 1000 parts by weight of n-hexane. A...

Embodiment 1

[0086] Embodiment 1 (preparation of negative photosensitive resin composition)

[0087] 100 parts by weight of the acrylic copolymer solution prepared in Synthesis Example 1, 20 parts by weight of a photoinitiator represented by the following chemical formula 4, and 5 parts by weight of a urethane acrylate oligomer having 10 functional groups were mixed. 20 parts by weight of dipentaerythritol hexaacrylate as a polyfunctional monomer having an ethylenically unsaturated bond, 3 parts by weight of a melamine crosslinking agent represented by the following chemical formula 5, and (3-shrinkage Glyceryloxypropyl) methyldiethoxysilane 2 parts by weight. After adding and dissolving propylene glycol methyl ether acetate to the mixture so that the solid content would be 20% by weight, it was filtered through a 0.2-μm micromesh filter to prepare a photosensitive resin composition coating solution.

[0088] [chemical formula 4]

[0089]

[0090] [chemical formula 5]

[0091]

[...

Embodiment 2

[0093] Embodiment 2 (preparation of negative photosensitive resin composition)

[0094] A photosensitive resin composition coating solution was prepared using the same method as in Example 1, except that a photoinitiator represented by the following Chemical Formula 6 was used instead of the photoinitiator represented by Chemical Formula 4 in Example 1.

[0095] [chemical formula 6]

[0096]

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Abstract

The present invention provides a photosensitive resin composition. The photosensitive resin composition according to an embodiment of the present invention uses an oxime photoinitiator, a multifunctional monomer, a melamine cross-linking agent, and a silane coupling agent to form an organic insulation that can simultaneously meet the requirements of resolution and adhesion. membrane.

Description

technical field [0001] The invention relates to a photosensitive resin composition and a method for forming patterns by using the composition. Background technique [0002] In general, flat panel display devices are currently widely used display devices, such as liquid crystal display (Liquid crystal display; LCD) and organic light emitting display (Organic light emitting display; OLED) and other types. [0003] In the process of forming such a flat panel display device, a photosensitive process can be used for the patterning of the film, and a photoresist material is used at this time. Alternatively, the film can be directly formed by exposing and developing a photoresist material. [0004] This kind of photoresist can be used to form an insulating film, columnar spacer, overcoat or color filter layer, but the composition structure of the photosensitive resin composition used to form the photoresist has a great impact on the resolution, adhesion and residual film rate. et...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/004G03F7/028G03F7/26H01L21/027
CPCG03F7/027G03F7/033G03F7/0755G03F7/038G03F7/031G03F7/004G03F7/0045G03F7/028G03F7/20G03F7/2002G03F7/26H01L21/027
Inventor 尹赫敏朴廷敏金智贤李政洙
Owner DONGJIN SEMICHEM CO LTD