Method for stripping ultra-thin glass from bearing substrate

Abstract

The invention discloses a method for stripping ultra-thin glass from a bearing substrate for solving the problem that the rate of finished products is reduced as a result that the efficiency of stripping the ultra-thin glass from the bearing substrate in the prior art is relatively poor. The method disclosed by the invention comprises the steps: forming at least one tubular object on the bearing substrate, and / or forming at least one channel on the bearing substrate; forming an adhesive layer between the bearing substrate and the ultra-thin glass; introducing a stripping agent into the tubular object through an orifice of at least one tubular object and / or introducing the stripping agent into the channel through a channel opening of the at least one channel, wherein the introduced stripping agent is contacted with the adhesive layer; and after carrying out chemical reaction on the stripping agent and the adhesive layer, stripping the ultra-thin glass from the bearing substrate. According to the method disclosed by the invention, the efficiency for stripping the ultra-thin glass from the bearing substrate can be improved and the rate of finished products can be improved.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a method for peeling ultra-thin glass from a carrier substrate. Background technique [0002] In the prior art, ultra-thin display devices are usually manufactured by using a method of manufacturing thinned glass or a method of attaching ultra-thin glass to a carrier substrate. In the manufacturing method of the thinned glass, after the display device is manufactured, the glass needs to be ground / polished, but the grinding / polishing process is very complicated and the cost is high. [0003] The method for attaching the ultra-thin glass to the carrier substrate includes: firstly, the ultra-thin glass and the carrier substrate need to be attached through the adhesive layer (such as Figure 1a As shown, the schematic diagram of the ultra-thin glass and the carrier substrate after being attached by the adhesive layer, from Figure 1a It can be known that a is the carrier substrate, ...

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Problems solved by technology

[0006] The invention provides a method for peeling ultra-thin glass from a carrier substrate, which is used to solve the problem in the prior art that the efficiency of peeling ultra-thin glass from the carrier substrate is poor, thereby reducing the yield

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