Method for stripping ultra-thin glass from bearing substrate
A technology for carrying substrates and ultra-thin glass, which is applied in the manufacture of electrical components, electrical solid devices, and semiconductor/solid-state devices, etc. Efficiency, good thermal conductivity effect
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[0053] In the embodiment of the present invention, at least one tubular object is formed on the carrier substrate, and / or at least one channel is formed on the carrier substrate; an adhesive layer is formed between the carrier substrate and the ultra-thin glass; The nozzle of the object is passed into the stripping agent to the tubular object and / or the stripping agent is passed into the channel through at least one channel opening of the channel, so that the passed-in stripping agent is compatible with the The adhesive layer is in contact; after the peeling agent chemically reacts with the adhesive layer, the ultra-thin glass is peeled off from the carrier substrate. Since the embodiment of the present invention forms at least one tubular object on the carrier substrate and / or at least one channel on the carrier substrate, the release agent is introduced through the nozzle of the at least one tubular object and / or the channel opening of the at least one channel, Contact with ...
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