A heat dissipation structure of a mobile terminal and the mobile terminal

Abstract

The invention discloses a heat dissipation structure of a mobile terminal, which includes a mounting bracket. A mainboard heat dissipation area for controlling the temperature rise of the mainboard module and a camera heat dissipation area for controlling the temperature rise of the camera module are arranged side by side on the mounting bracket. The heat dissipation area of ​​the main board is arranged close to one side of the main board module, and the heat dissipation area of ​​the camera is located on the side of the heat dissipation area of ​​the main board away from the camera module. In this scheme, a camera heat dissipation area for controlling the temperature rise of the camera module is set in an area other than the main board module and the camera module, so that the heat of the camera module is isolated from the heat of the main board module, and the mutual heat of the two is avoided. It affects the heat dissipation efficiency of the other party, and even affects the normal work of the other party, so as to ensure the heat dissipation efficiency and stable operation of the motherboard module and the camera module at the same time.

Description

technical field [0001] The present invention relates to the technical field of terminal heat dissipation, in particular to a heat dissipation structure of a mobile terminal and the mobile terminal, and further, to a heat dissipation structure of a mobile phone and the mobile phone. Background technique [0002] In modern society, the pace of life of people is getting faster and faster, and the communication between people is getting closer and more frequent. People rely heavily on communication equipment. Among them, the mobile phone is one of the most widely used communication terminals. The mobile phone is favored and popularized by people because of its portability, simple operation and comprehensive functions. The mobile phone is a mobile terminal with a small size, but people have a high demand for the functions and processing capabilities of the mobile phone. Therefore, the integration of mobile phones is getting higher and higher, and the CPU cores of mobile phones ar...

AI Technical Summary

Problems solved by technology

[0004] At present, the camera part is usually wrapped with a layer of copper foil or a layer of graphite is pasted on the back to solve the heat dissipation problem. However, with the compression of the structural space and the limitation of the thickness of the whole machine, the structural design of the camera part is becoming more and more complicated.

For example, in order to solve the problem of the thickness of the whole machine, the motherboard module will be placed in the middle frame. At this time, due to the thickness of the camera, the metal area on the back of the camera is at the same height as the motherboard module. Graphite or copper foil to solve the heat dissipation problem

[0005] In addition, since the camera part is generally located in the area close to the main board module, and the main board module area and the camera part are both high-temperature areas, even if the camera part is effectively connected to the middle frame, there will also be the disadvantage that the high-temperature area will affect the heat dissipation efficiency.

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