Breaking method and breaking device

Abstract

The present invention relates to a fracturing method and fracturing device capable of effectively performing fracturing with a low load along predetermined fracturing lines orthogonal to each other without moving or reversing a substrate placed on a platform. Fractured to cut out the unit product. This is achieved by placing the substrate (W) on an adsorption platform (1) provided with protrusions (1b) corresponding to mutually orthogonal grid-shaped scribing lines (S1, S2) and using the adsorption platform ( 1) Adsorption is carried out, and the part of the substrate (W) in contact with the convex part (1b) is curved and raised into a convex shape, and the top surface of the curved raised part (14) is scored by using the scoring line forming member (11), In this way, a scribed line is formed on the substrate (W), and at the same time, due to the tensile stress generated in the curved ridge (14) of the substrate (W), the cracks of the scribed line penetrate into the thickness direction of the substrate to seal the substrate (W ) along the scoring line and cut out the unit product (W1) divided into grids.

Description

technical field [0001] The present invention relates to a method and device for breaking substrates made of brittle materials such as glass, silicon, ceramics, etc. A cutting method and a breaking device for cutting out a quadrangular unit product such as a cover glass of a liquid crystal display panel by breaking a wire. Background technique [0002] In the past, it is known to form a scribed line (groove) on the surface of a brittle material substrate such as glass (hereinafter referred to as "substrate"), and press it with a breaking rod along the scribed line, or press it with a roller to rotate it, etc. A method of breaking a substrate by bending it is widely practiced. [0003] In addition, as a means of forming a scribe line, there are a method using a blade body such as a cutter wheel (also called a scribe wheel), and a method using a laser beam. [0004] In the case of using a blade, it is a method of forming a continuous groove on the substrate surface by relativ...

AI Technical Summary

Problems solved by technology

[0008] However, in this method, since the fissure of the scribed line has a finite depth, it is necessary to further perform a breaking step for complete separation from the scribed line

In addition, in this method, even if it is assumed that the crack of the scribe line can be completely broken by increasing the pressing load of the cutter wheel, very troublesome work is required for breaking in the direction perpendicular to the direction in which the protrusion extends.

That is, it is necessary to take out the left and right substrates divided along the extending direction of the protrusions, and set them again in the device for each direction change. Since this operation is complicated and takes a long time, it is actually difficult to implement on the production line.

Images