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Method for preparing thin film by laser precision molding, molding device and demoulding device

A molding and thin-film technology, which is applied in the field of thin-film preparation by laser precision molding, can solve problems such as difficulty in demoulding thin-film parts, and achieve the effects of fast preparation speed, good application prospects, and small surface roughness

Active Publication Date: 2017-01-18
MATERIAL INST OF CHINA ACADEMY OF ENG PHYSICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to: when precision molding is used to prepare film-type parts at present, when the size of the part becomes thinner and the mechanical strength of the material itself becomes smaller, the interface bonding force and friction between the part and the mold will play a major role, resulting in thin film In order to solve the problem of difficulty in demolding molded parts, a method for preparing thin films by laser precision molding, a molding device and a demoulding device are provided

Method used

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  • Method for preparing thin film by laser precision molding, molding device and demoulding device
  • Method for preparing thin film by laser precision molding, molding device and demoulding device
  • Method for preparing thin film by laser precision molding, molding device and demoulding device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0073] Example 1 Preparation of Aluminum Thin Film

[0074] 1. Glass mold preparation

[0075] Sapphire glass with a diameter of 10mm and a thickness of 8mm is processed, polished on both sides, and the surface quality is 60 / 40. Take a piece of sapphire glass and plate a TiN / Ti thin film with a thickness of 5 microns, an outer diameter of 10 mm and an inner diameter of 7 mm on a magnetron sputtering coating machine, and record the coated sapphire glass as the upper mold. Another piece of polished glass is taken as the lower mold, and the upper mold and the lower mold form the molding mold.

[0076] 2. Raw material preparation

[0077] Cut aluminum into small particles, and weigh 100 micrograms of aluminum particles with a balance with a minimum sensitivity of 10 micrograms. Aluminum pellets are placed in the central area of ​​the lower mold.

[0078] 3. Sample installation

[0079] Install compression scales, springs, heat insulation gaskets, lower molds, aluminum particl...

Embodiment 2

[0098] Example 2 Preparation of Tin Film

[0099] 1. Glass mold preparation

[0100] Sapphire glass with a diameter of 10mm and a thickness of 8mm is processed, polished on both sides, and the surface quality is 60 / 40. Take a piece of sapphire glass and plate a TiN / Ti thin film with a thickness of 5 microns, an outer diameter of 10 mm and an inner diameter of 7 mm on a magnetron sputtering coating machine, and record the coated sapphire glass as the upper mold. Another piece of polished glass is taken as the lower mold, and the upper mold and the lower mold form the molding mold.

[0101] 2. Raw material preparation

[0102] Cut tin into small particles, and weigh 250 micrograms of tin particles with a balance with a minimum sensitivity of 10 micrograms. Tin particles are placed in the central area of ​​the lower mold.

[0103] 3. Sample installation

[0104] Install compression scales, springs, heat insulation gaskets, lower molds, aluminum particles, upper molds, heat i...

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Abstract

The invention discloses a laser precise die pressing thin film preparing method, a die pressing device and a demoulding device, and aims to solve the problem of difficult demoulding of a thin film part caused by the fact that when precise pressing is adopted to prepare a thin film, when the part is thinned, the mechanical intensity of a material is reduced, an interface bonding force and friction force between the part and a die play a leading role. The method comprise following steps: sample mounting, pre-deformation, heating die pressing, cracking-resistant annealing, and demoulding. The invention belongs to an equivalent deformation method, and the laser precise die pressing generates little waste, is less harmful to environment, high in machining speed, efficient, short in time and capable of meeting industrialized large-scale bath production requirements, and has a better application prospect. The method can prepare a metal thin film which has the thickness of 1micrometer, and is compact, small in surface coarseness, excellent in parallelism and planeness and high in yield.

Description

technical field [0001] The invention relates to the field of film preparation, in particular to a method for preparing a film by laser precision molding, a molding device and a demoulding device. In the invention, the metal thin film is molded on the glass substrate through laser heating, and the mold is demolded through pulse laser heat shock. The invention can prepare a metal thin film with a diameter of more than 5 mm and a thickness as thin as 1 micron, and the thin film is dense and the surface roughness is small. Background technique [0002] Thin-film metal devices have important applications in research and production. In the study of the high-pressure equation of state (EOS) of materials, the preparation of metal thin films with material bulk density is very important for studying the high-pressure shock wave stability of materials, the shock wave adiabatic line and the absolute measurement of the state equation. This type of film generally requires a thickness of...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B38/00B32B37/06B32B37/10B32B38/10B32B37/00
CPCB32B37/0046B32B37/06B32B37/10B32B38/0012B32B38/10B32B2037/1081B32B2038/0048
Inventor 张永彬陈志磊刘柯钊胡殷廖益传吕学超
Owner MATERIAL INST OF CHINA ACADEMY OF ENG PHYSICS
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