Test socket with high density conduction section

A technology for testing sockets and conductive parts, which is applied in the direction of single semiconductor device testing, sensors, and measuring electricity. It can solve problems such as damage, conductivity-enhanced film deformation, and fracture, and achieve the effects of easy contact, improved conductivity, and durability.

Active Publication Date: 2015-10-28
ISC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] Although the conductivity of the test socket is improved due to the conductivity-enhanced film, since the conductivity-enhanced film protrudes from the conductive silicone portion, the conductivity-enhanced film may be easily deformed or damage
Specifically, the conductivity-enhanced film may deform and break due to frequent contact with the terminals

Method used

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  • Test socket with high density conduction section
  • Test socket with high density conduction section
  • Test socket with high density conduction section

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0046] Hereinafter, the test socket according to the embodiment of the present invention will be described in detail with the drawings.

[0047] Figure 4 to Figure 6 A test socket (100) according to an embodiment of the present invention is explained. The test socket (100) is disposed between the device (800) to be tested and the test equipment (900) to electrically connect the terminals (801) of the device (800) to the pads (901) of the test equipment (900).

[0048] The test socket (100) includes an elastic conductive sheet (110), a supporting sheet (120), and a second conductive part (130).

[0049] The elastic conductive sheet (110) allows current to flow in its thickness direction, but does not allow current to flow in its surface direction perpendicular to the thickness direction. The elastic conductive foil (110) is elastically compressible to absorb any impact applied by the terminals (801) of the device (800). The elastic conductive sheet (110) includes a first co...

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PUM

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Abstract

The present invention relates to a test socket with a high density conduction section, and more particularly the test socket arranged between a blood test device and a test apparatus for electrically connecting the terminal of the blood test device and the pad of the test apparatus includes: a first electrical conduction part arranged at the position corresponding to the terminal of the blood test device consisting of a plurality of first electrical conduction particles arranged in the direction of the thickness in a resilient material; a resilient electrical conduction sheet including an insulation support part for supporting the first electrical conduction part by insulating an adjacent first electrical conduction part; a support sheet attached to the upper side of the resilient electrical conduction sheet having a through-hole formed at every position corresponding to the terminal of the blood test device; and a second electrical conduction part filling the through hole of the support sheet consisting of a plurality of second electrical conduction particles arranged in the direction of the thickness in a resilient material, characterized in that the second electrical conduction particles are arranged in the resilient material with a higher density than the first electrical conduction particles, and the though holes have the upper end with a larger diameter than that of the lower end.

Description

technical field [0001] The present invention relates to test sockets having high density conductive portions, and more particularly to test sockets having durable high density conductive portions capable of making reliable electrical contact with terminals of a device under test. Background technique [0002] In general, when testing the electrical characteristics of a device, the device is stably electrically connected to the test equipment. Test sockets are generally used to connect the device under test with the test equipment. [0003] The function of such test sockets is to connect the terminals of the device under test to the pads of the test equipment so as to allow bi-directional transmission of electrical signals therebetween. For this purpose, elastic conductive foils or spring-loaded thimbles are used as contact parts in the test socket. The elastic conductive sheet is used to make the elastic conductive part contact with the terminal of the device to be tested,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/26G01R1/067
CPCG01R1/0466A61B5/00G01R1/07378H01R12/73H01R13/2414G01R1/0416
Inventor 李载学
Owner ISC CO LTD
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