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Chip scale package LED packaging method

A technology of chip-level packaging and packaging methods, applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve problems such as unsuitable for large-scale production, complicated packaging process, and huge manpower and material resources

Inactive Publication Date: 2015-11-11
HONGLI ZHIHUI GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the above technology can also achieve single-sided light emission of the product, its packaging process is relatively complicated, and the reflective surface used to block light is formed by spraying, which can only be implemented for a single LED. In mass production, The manpower and material resources consumed by the process are undoubtedly huge, and it is not suitable for large-scale production

Method used

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  • Chip scale package LED packaging method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] like figure 1 Shown, a kind of package method of chip-scale package LED comprises the following steps:

[0027] (1) A layer of fixed film 2 for fixing the position of the LED chip 4 is arranged on the carrier plate 1; the fixed film 2 of this embodiment is a UV double-sided tape film, and the carrier plate 1 is a glass plate; the UV double-sided tape film can be It is directly fixed on one side of the glass plate by pasting, and then the UV double-sided tape film can be separated from the glass plate by irradiating the other side of the glass plate;

[0028] (2) A number of LED chips 4 are distributed on the surface of the fixed film 2. The number of LED chips 4 can be set according to the size of the glass plate, or according to production requirements. The LED chips 4 are distributed in an array, and the adjacent LED chips There are gaps for cutting between 4, and the width of each gap is consistent to ensure the consistency of each LED after cutting; the LED chip 4 ...

Embodiment 2

[0036] like figure 1 Shown, a kind of package method of chip-scale package LED comprises the following steps:

[0037] (1) A layer of fixing film 2 for fixing the position of the LED chip 4 is arranged on the carrier plate 1; the fixing film 2 of this embodiment is a heat-separation tape film, and the carrier plate 1 is a glass plate; the heat-separation tape film can be directly passed through The pasting method is fixed on one side of the glass plate, and then the carrier plate 1 can be heated to separate the thermal separation tape film from the carrier plate 1;

[0038] (2) A number of LED chips 4 are distributed on the surface of the fixed film 2. The number of LED chips 4 can be set according to the size of the glass plate, or according to production requirements. The LED chips 4 are distributed in an array, and the adjacent LED chips There are gaps for cutting between 4, and the width of each gap is consistent to ensure the consistency of each LED after cutting; the LE...

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Abstract

The invention relates to a chip scale package LED packaging method, which comprises the steps that (1) a fixing film used for fixing positions of LED chips is arranged on a carrier plate; (2) a plurality of LED chips are distributed at the surface of the fixing film, the LED chips are distributed in an array mode, and a gap is reserved between the adjacent LED chips; (3) the LED chips are covered with a layer of fluorescent glue, the gap between the adjacent LED chips can be filled with the fluorescent glue, and the top surface of four side surfaces of each LED chip are wrapped by the fluorescent glue; a protective film is attached to the surface of a fluorescent glue layer after the fluorescent glue is solidified; (5) cutting is carried out at the gap between the adjacent LED chips, the adjacent LED chips form a channel therebetween, and the channel can cut the fluorescent glue layer and the protective film; (6) each channel is filled with light blocking glue; (7) cutting is carried out on a light blocking glue layer after the light blocking glue is solidified, and the light blocking glue layer is cut to the fixing film; and (8) the single LED chip is separated from the fixing film and the protective film so as to form a single finished product.

Description

technical field [0001] The invention relates to LED packaging, in particular to a packaging method for chip-level packaging of white light LEDs. Background technique [0002] A new type of chip-scale package LED (CSPLED; ChipScale LED) based on flip-chip [0003] PackageLED) is to have electrodes on the bottom surface of the chip in the packaging structure, and directly encapsulate the colloid on the upper surface and side of the chip, so that the electrodes on the bottom surface are exposed. Since this packaging structure has no support or substrate, the packaging cost can be reduced. Existing chip-scale packaged LEDs usually emit light from five sides, that is, both the top surface and the four sides of the LED can emit light, and the packaging process of this kind of LED is relatively simple. With the improvement of people's requirements for the angle and consistency of light output of products, the current chip-scale package LED structure can no longer meet people's nee...

Claims

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Application Information

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IPC IPC(8): H01L33/48H01L33/50
CPCH01L33/48H01L33/505H01L2933/0033H01L2933/0041
Inventor 熊毅杜金晟王跃飞吕天刚李国平
Owner HONGLI ZHIHUI GRP CO LTD
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