Non-epoxy sealed mini temperature controller

A temperature controller and epoxy sealing technology, which is applied in the direction of electrical components, electric switches, circuits, etc., can solve the problems of long curing time, strong allergies of epoxy resin, and high material cost, so as to improve market efficiency, save costs, Overcoming allergic strong effects

Inactive Publication Date: 2015-11-18
YANGZHOU BAOZHU ELECTRIC APPLIANCE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention uses plastic blocks to replace the epoxy resin potting process in the prior art, overcomes the defects of strong epoxy resin allergy, long curing time, and high material cost, saves costs, and improves market benefits

Method used

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  • Non-epoxy sealed mini temperature controller
  • Non-epoxy sealed mini temperature controller

Examples

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Embodiment Construction

[0011] Such as figure 1 , 2 As shown, it includes a housing 1 with an open end, a metal bottom plate 2 is provided in the housing 1, a base 3 and a static contact 4 are provided on the metal bottom plate 2, and a contact is provided on one end of the base 3 away from the static contact 4 Sheet 5, the housing 1 above the base 3 is provided with a spring sheet 6 and a bimetal sheet 7. The spring sheet 6 is stacked on the bimetal sheet 7, and one end of the spring sheet 6 and the bimetal sheet 7 is welded to the contact sheet 5. On the upper side, the middle part of the spring sheet 6 and the bimetal sheet 7 is supported on the base 3, and the other end of the spring sheet 6 is provided with a movable contact 8 which is matched with the static contact 4.

[0012] Two horizontally arranged pins 9 are provided in the open end of the housing 1, one pin 9 is electrically connected to the metal bottom plate 2, and the other pin 9 is electrically connected to the bimetallic strip 7. The op...

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PUM

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Abstract

A non-epoxy sealed mini temperature controller relates to the field of electric components. The controller comprises a casing, the casing is internally provided with a metal substrate, the metal substrate is provided with a pedestal and a static contact, the pedestal is provided with a contact sheet, a spring leaf and a bimetallic strip are arranged in the casing over the pedestal, one end of spring leaf and one end of the bimetallic strip are welded to the contact sheet, the middle portion of the spring leaf and the middle portion of the bimetallic strip are supported by the pedestal, the other end of the spring sheet is provided with a movable contact cooperated with the static contact, an open end of the casing is internally provided with two pins, one pin is electrically connected with the metal substrate, the other pin is electrically connected with the bimetallic strip, a plastic block is embedded into the open end of the casing, and the two pins penetrate the plastic block and extend out of the casing. The plastic block is used to replace epoxy resin embedding technology to overcome the disadvantages that epoxy resin is high in irritability, long in solidification time and high in material cost, the cost is saved, and the market efficiency is improved.

Description

Technical field [0001] The invention relates to the field of electrical components, in particular to an epoxy-free sealed miniature temperature controller. Background technique [0002] Similar products on the market all use epoxy resin potting to achieve the effect of fixing and sealing, but epoxy resin has strong allergy, long curing time and high material cost. This virtually increases manufacturing difficulty and cost. Moreover, this method cannot guarantee the uniformity of the protector pin spacing, and will contaminate the pins, making it unsuitable for PCB board jack installation. Summary of the invention [0003] The purpose of the present invention is to provide an epoxy-free sealed miniature temperature controller with a simple structure and adjustable pin spacing. [0004] The technical solution to achieve the above objective is: epoxy-free sealed miniature temperature controller, including a shell with one end open, a metal bottom plate is arranged in the shell, a bas...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01H37/54
CPCH01H37/5427
Inventor 李健伟王伟黄晓飞范茂勇朱宣波
Owner YANGZHOU BAOZHU ELECTRIC APPLIANCE CO LTD
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