Method for manufacturing LED center substrate based on inorganic matter

Abstract

The invention relates to a method for manufacturing an LED center substrate based on inorganic matter. The method for manufacturing the LED center substrate based on the inorganic matter comprises the steps that polishing treatment is conducted on a Cu substrate; chemical degreasing is conducted on the polished Cu substrate; after washing, derusting is conducted on the Cu substrate by means of a hydrochloric acid solution with the temperature of 40 DEG C; under the condition of the constant temperature of 40 DEG C, electrolytic degreasing is conducted on the Cu substrate by means of a degreaser solution with the mass concentration being 70-80 g / L; after washing, the Cu substrate is soaked in diluted hydrochloric acid with the mass fraction being 5% for one minute, so that the Cu substrate is activated; after washing, composite electroplating is conducted on the activated Cu substrate, so that a nano SiC layer is formed on the surface of one side of the Cu substrate; and after washing, drying and packaging are conducted, so that the SiC-Cu composite center substrate is obtained.

Description

Technical field [0001] The present invention relates to the field of semiconductors, and in particular to a method for manufacturing an LED center substrate based on inorganic substances. Background technique [0002] In the development of traditional semiconductor display products to this day, supporting or cross-industry resources have been greatly enriched and improved. In the structure of traditional LED products, FR4 circuit boards are usually used as LED circuit substrates. [0003] However, when a traditional circuit board is used as an LED circuit substrate, the impurities, pores, thermal stress, thermal expansion and other defects in the material will cause fatal hidden dangers to product stability and reliability. Moreover, when the resolution of the semiconductor display is increased to a certain level (for example, when the pixel pitch is required to be less than 1 mm), processing cannot be achieved. Therefore, the traditional circuit board is completely unable to mee...

AI Technical Summary

Problems solved by technology

[0003] However, when the traditional circuit board is used as the LED circuit substrate, the impurities, pores, thermal stress, thermal expansion and other defects in the material will cause fatal hidden dangers to product stability and reliability.

Moreover, when the resolution of the semiconductor display is increased to a certain extent (for example, when the pixel pitch is required to be less than 1MM), the processing cannot be realized.

Therefore, traditional circuit boards are completely unable to meet the requirements of small size and high precision.

At the same time, the subsequent bonding process with LEDs is cumbersome, and the consistency of performance among multiple LED chips carried by an LED circuit substrate cannot be guaranteed, which may affect the performance of the final product

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